WMSIC Electronic Components

SHIKUES BAS321

ModelBAS321
PackageSOD-323
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES BAS321
Type
SHIKUES
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
BAS321
Electronic Component
1
Package
SOD-323
Electronic Component
Switch Diode
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0262570088
Current
200mA
Diode
Electronic Component
(Vf)
1.25V@200mA
Power Dissipation(Pd)
200mW
Electronic Component
65℃~+150℃@(Tj)
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAS321 产品概述

BAS321 是时科(SHIKUES)推出的一款独立式开关二极管,采用 SOD-323 小封装,面向高压、低电流的快速开关与保护应用。器件在200 mA 工作电流点有较低的正向压降,同时具备较高的反向耐压和较快的反向恢复性能,适合便携式设备、通信前端和通用电子板级保护电路。

一、主要参数亮点

  • 二极管类型:独立式(单只)
  • 正向压降:Vf = 1.25 V @ If = 200 mA
  • 直流反向耐压:Vr = 200 V
  • 最大整流电流:If = 200 mA
  • 耗散功率:Pd = 200 mW
  • 反向恢复时间:Trr = 50 ns(快速恢复特性)
  • 非重复峰值浪涌电流:Ifsm = 2.5 A
  • 工作结温范围:Tj = -65 ℃ ~ +150 ℃
  • 封装:SOD-323(表面贴装,小体积)

二、产品特性与优势

  • 高耐压:200 V 的反向耐压适用于高压侧的开关与整流场景,能在较高偏压下长期稳定工作。
  • 低 Vf 与低功耗:在 200 mA 工作点 Vf ≈ 1.25 V,有利于降低功耗并减小发热,配合 Pd = 200 mW 适用于低功耗应用。
  • 快速开关:Trr = 50 ns,适合高频开关与脉冲处理,能够减少反向恢复带来的开关损耗与干扰。
  • 小封装:SOD-323 便于高密度贴片、体积受限设计与自动贴装生产。

三、典型应用场景

  • 高压小电流整流与开关电路
  • 开关电源与次级抑制回路
  • 通信设备的防浪涌/防反接保护
  • 信号整形、脉冲整流与快速开关应用
  • 小型便携设备与物联网终端的版级保护

四、封装与可靠性建议

  • 封装:SOD-323,适配常见贴片工艺,推荐采用自动贴片与回流焊装配。
  • 回流焊:建议按行业标准(如 JEDEC J-STD-020)选用合适的回流峰值温度曲线,避免超过器件最大结温。
  • 储存与防静电:建议干燥包装出厂,贴片器件注意 ESD 防护与湿敏等级处理。

五、选型与使用注意

  • 工作点匹配:若电路工作电流长时间接近 200 mA,应关注封装散热与环境温度,避免超过 Pd 限制导致结温升高。
  • 浪涌能力:短时峰值浪涌能力 Ifsm = 2.5 A,可应对短脉冲浪涌,但不适合频繁大电流冲击场合。
  • 反向恢复:50 ns 的 Trr 对于中高频开关适用,但在更高频率或功率敏感电路中需评估开关损耗与 EMC 影响。

六、采购与技术支持

如需样品、技术资料(完整参数曲线、封装尺寸、焊接推荐曲线)或批量采购,建议联系 SHIKUES(时科)授权经销商或直接获取器件数据手册以便在设计验证阶段进行充分测试。购买时请确认封装标识为 SOD-323 并核对出厂检验报告以保证性能一致性。

BAS321 以其高耐压、低压降和快速恢复的特性,在需要高压耐受与快速开关能力的细分应用中提供了性价比较高的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.