WMSIC Electronic Components

SHIKUES 2SC2412K

Model2SC2412K
PackageSOT-23
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES 2SC2412K
Type
SHIKUES
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
2SC2412K
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0264580613
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
160MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SC2412K 产品概述

一、主要特性

2SC2412K 为 SHIKUES(时科)出品的一款低功耗 NPN 小信号晶体管,采用 SOT-23 封装,适合空间受限的表贴电路板。器件具有较高的直流电流增益和较好的高频特性,适用于小信号放大与开关场合。器件单颗销售(数量:1 个 NPN)。

二、主要电气参数

  • 晶体管类型:NPN(双极型晶体管)
  • 集电极电流 Ic(最大):150 mA
  • 集-射极击穿电压 Vceo(典型/最低):50 V
  • 最大耗散功率 Pd:200 mW(封装限制,环境温度与散热条件会影响使用上限)
  • 直流电流增益 hFE:390(高增益,适合低电流放大)
  • 特征频率 fT:160 MHz(良好的高频响应,可用于 VHF 级放大)
  • 集电极截止电流 Icbo:100 nA(漏电流小,有利于低噪声设计)
  • 集-射极饱和电压 VCE(sat):约 400 mV(在适当偏流和驱动下实现低饱和压降)
  • 射-基极击穿电压 Vebo:7 V(避免对基极反向施加超过此值)
  • 工作温度范围:-55 ℃ ~ +150 ℃(工业级温度范围)

三、封装与热特性

器件采用 SOT-23 小外形封装,便于自动贴装与高密度布局,但封装体积小导致散热能力有限。额定耗散功率 200 mW 为常温参考值,随着环境温度上升需按热阻进行降额使用;建议在设计中预留散热措施和避免长时间大电流运行。

四、典型应用

  • 小信号放大器:音频前级、射频前端的低功率放大器(得益于高 hFE 与 fT)。
  • 开关应用:低至中等电流开关场合,如驱动小继电器、LED 驱动(需关注功耗与饱和压降)。
  • 信号处理与缓冲:电平移位、缓冲放大器、模拟开关外围电路。
  • 便携设备与通信终端:空间受限且需中等频率响应的模块中使用。

五、设计注意事项与布局建议

  • 电流与功率限制:工作电流不应超过 150 mA,且在高 Ic 条件下注意 Pd 限制和封装热降额。
  • 驱动与饱和:若用于开关,保证基极有足够驱动电流以实现低 VCE(sat),同时避免过度基流造成过热。
  • 布局:SOT-23 引脚短、走线短且宽;地与电源回路尽量短,必要时在封装附近加热沉铜或过孔以改善散热。
  • 保护:注意 Vebo(7 V)限制,禁止基极反向承受高电压;对感性负载应添加抑制二极管或 RC 抑制网络。
  • 测试条件:参数(尤其 VCE(sat)、hFE)受测试条件影响,实际设计时以厂方完整数据手册曲线为准。

六、可靠性与环境适应

本器件工作温度范围宽(-55 ℃ 至 +150 ℃),适合工业温度环境。SOT-23 封装便于自动化贴片生产,存储与焊接条件请参照供应商的包装与回流温度规范。若需要符合 RoHS 或特定认证,请向供应商确认并索取合规声明与可靠性试验报告。

七、订购与技术支持

品牌:SHIKUES(时科)。单颗包装适合小批量样品与工程验证。建议在设计验证阶段向供应商索取完整数据手册、典型电路、温升曲线及样片以便做进一步电路仿真与热分析。如需替代型号或在高功率/高频条件下的优化建议,可与技术支持沟通获取匹配零件与布局建议。

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