WMSIC Electronic Components

SHIKUES DS34W

ModelDS34W
PackageSOD-123FL
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES DS34W
Type
SHIKUES
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
DS34W
Electronic Component
1
Package
SOD-123FL
Electronic Component
Schottky Diode
Electronic Component
0.041g
Electronic Component
1
Electronic Component
BM0264580604
Current
3A
Diode
Electronic Component
Current(Ir)
500uA@40V
(Vf)
550mV@3A
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DS34W肖特基二极管产品概述

DS34W是SHIKUES(时科)推出的独立式肖特基二极管,针对中低压整流/续流场景优化设计,核心优势聚焦低正向压降、高电流密度、小体积封装,可满足消费电子、汽车电子、工业控制等领域的效率提升与小型化需求。以下从产品属性、性能参数、应用场景等维度展开详细说明:

一、产品基本属性定位

DS34W属于中功率肖特基二极管,采用独立式配置(无并联/串联集成),精准匹配12V/24V等低压系统的整流与续流需求。依托金属-半导体接触的肖特基势垒效应,相比传统硅整流二极管,具有无反向恢复时间、导通损耗极低的核心特点;同时优化了电流承载能力与抗浪涌性能,适配高密度PCB布局的现代电子设计趋势。

二、核心电气性能参数解析

DS34W的参数设计紧扣低压高效场景,关键参数的实际价值明确:

  1. 正向压降(Vf):550mV@3A
    该参数是产品核心竞争力——3A持续电流下仅0.55V的导通压降,比普通硅管(如1N4007@1A约1V)低45%以上。例如,3A负载时导通损耗仅1.65W,远低于硅管的3W,可显著减少电路发热、提升电源效率(如移动电源充电效率可提升3%~5%)。
  2. 直流反向耐压(Vr):40V
    满足12V/24V系统的电压波动需求(典型系统电压波动范围≤10%),40V的耐压余量可避免反向击穿风险,提升长期可靠性。
  3. 持续整流电流(If):3A
    稳定承载典型低压电源的输出电流(如24V/3A电源模块、车载充电器的5V/3A输出),适配中功率负载场景。
  4. 反向漏电流(Ir):500μA@40V
    额定电压下漏电流控制在500μA以内,长期工作时漏电流产生的额外损耗极小(≈40V×0.5mA=20mW),进一步降低发热、延长器件寿命。
  5. 非重复峰值浪涌电流(Ifsm):80A
    可承受瞬间脉冲电流(如开机浪涌、雷击感应脉冲),避免器件因瞬间过流损坏,提升系统抗干扰能力(如汽车启动瞬间的10A级脉冲可安全应对)。
  6. 工作结温范围:-55℃~+125℃
    覆盖工业级宽温需求,可在极端环境(如汽车发动机舱的85℃高温、户外设备的-40℃低温)下稳定工作。

三、封装形式与物理特性

DS34W采用SOD-123FL表面贴装封装,该封装的设计特点适配小型化需求:

  • 小体积:典型尺寸约2.9mm×2.4mm×1.1mm,仅为传统插件二极管的1/5,可有效节省PCB空间(如移动电源、无线充电器的紧凑布局);
  • 散热优化:封装底部与侧面的金属焊盘设计,可通过PCB铜箔辅助散热,满足3A持续电流的热管理需求;
  • 工艺兼容:符合RoHS环保标准,支持回流焊、波峰焊等主流表面贴装工艺,便于批量生产与自动化组装。

四、典型应用场景

DS34W的参数特性使其适配多领域低压电路,典型应用包括:

  1. 消费电子:移动电源(升压-降压电路的续流二极管)、无线充电器(整流级)、12V电源适配器(输出整流)——低损耗可延长电池续航、提升充电效率;
  2. 汽车电子:车载充电器(12V转5V/9V/12V整流)、汽车仪表盘电源(低电压整流)——宽温范围适配发动机舱的高温环境,抗浪涌能力应对汽车启动瞬间的脉冲;
  3. 工业控制:小型PLC电源模块(24V整流)、传感器供电电路(低损耗整流)——宽温与抗浪涌性能提升工业设备的稳定性;
  4. 通信设备:路由器、交换机的小型电源(5V/12V整流)——小体积封装适配设备的紧凑设计。

五、可靠性与品牌优势

SHIKUES(时科)作为专注功率半导体的品牌,DS34W的可靠性体现在:

  • 参数一致性:批量生产中正向压降、漏电流等参数偏差≤5%,提升电路设计的稳定性(无需额外冗余设计);
  • 环境适应性:-55℃~+125℃的结温范围与80A浪涌能力,满足严苛场景的可靠性要求;
  • 高性价比:相比进口同类器件(如某品牌同参数产品),价格降低15%~20%,适合中低端市场的批量应用。

总结

DS34W肖特基二极管凭借低正向压降(550mV@3A)、高电流承载能力(3A持续/80A浪涌)、小体积封装(SOD-123FL)及宽温适应性,成为12V/24V低压系统整流/续流的优选器件。其在消费电子、汽车电子、工业控制等领域的应用,可有效降低电路损耗、提升系统效率与可靠性,是中小功率电源设计的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.