WMSIC Electronic Components

SHIKUES SMF6.0A

ModelSMF6.0A
PackageSOD-123FL
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES SMF6.0A
Type
SHIKUES
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
SMF6.0A
Electronic Component
1
Package
SOD-123FL
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.039g
Electronic Component
1
Electronic Component
BM0265580756
Operating Temperature
55℃~+150℃
Voltage
10.3V
Current(Ir)
400uA
Voltage(VBR)
7.37V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF6.0A瞬态抑制二极管(TVS)产品概述

一、产品定位与核心属性

SMF6.0A是SHIKUES(时科)推出的单向瞬态抑制二极管(TVS),专为低电压电子系统的瞬态过压防护设计。其核心定位是在5V/6V直流工作电压范围内,快速抑制静电放电(ESD)、浪涌脉冲等瞬态干扰,保护后级敏感元器件(如MCU、传感器、通信接口芯片等)免受损坏。产品采用SOD-123FL表面贴装封装,具备小型化、高可靠性、宽温适应等特点,适用于消费电子、工业控制、汽车电子等多领域。

二、关键电气参数深度解析

SMF6.0A的电气参数经过严格设计,精准匹配低电压系统防护需求,核心参数及意义如下:

  1. 反向截止电压(Vrwm):6V
    这是TVS在正常直流工作状态下允许施加的最大反向电压,此时TVS处于截止状态,漏电流极小,不影响电路正常工作。对于5V供电系统(如USB接口、MCU IO口),6V的Vrwm可确保TVS在电路正常运行时无额外损耗。
  2. 击穿电压(Vbr):7.37V
    当施加的反向电压超过此值时,TVS从截止状态快速转变为导通状态,开始泄放瞬态电流。该参数一致性好,避免因击穿电压过高导致防护延迟。
  3. 钳位电压(Vc):10.3V
    这是TVS导通后能将电路电压钳位到的最高值(测试条件:10/1000μs脉冲波形)。对于耐压≤6V的敏感器件(如MCU),10.3V的钳位电压可有效避免后级器件过压损坏。
  4. 峰值脉冲电流(Ipp):19.4A@10/1000μs
    指TVS在指定脉冲波形下能承受的最大峰值电流,可应对常见浪涌干扰(如电源瞬变、雷击感应),支持多次脉冲冲击。
  5. 峰值脉冲功率(Ppp):200W@10/1000μs
    单次脉冲的最大功率容量,结合Ipp与Vc可验证(Ppp≈Vc×Ipp),满足多数低电压系统的防护需求。
  6. 反向漏电流(Ir):400μA
    反向截止状态下的漏电流处于行业较低水平,可减少电路静态功耗,适合便携式设备等对功耗敏感的场景。
  7. 工作温度范围:-55℃~+150℃
    宽温设计覆盖工业级、汽车级等严苛环境,极端温度下仍能保持稳定防护性能。

三、封装设计与可靠性优势

SMF6.0A采用SOD-123FL表面贴装封装,具备以下设计优势:

  1. 小型化适配:封装尺寸紧凑(约2.0mm×1.2mm),与0805封装兼容,可集成到高密度PCB设计中,满足智能手机、智能穿戴等便携式设备的小型化需求。
  2. 散热与可靠性:采用高导热材料封装,可快速散发放电产生的热量,避免热积累导致器件失效;封装结构坚固,抗机械应力能力强,适配回流焊、波峰焊等批量生产工艺。
  3. 环保合规:符合RoHS、REACH等环保标准,无铅无卤,适配全球市场要求。

四、典型应用场景

SMF6.0A的参数特性使其广泛应用于以下低电压系统:

  1. 消费电子:智能手机、平板电脑的USB接口、充电电路防护;智能穿戴设备的传感器接口防护。
  2. 工业控制:PLC输入输出口、工业传感器(温度、压力传感器)的过压防护;小型工业控制器的电源接口防护。
  3. 汽车电子:车载低压子系统(如车内LED照明、仪表盘传感器、倒车雷达接口)的瞬态干扰防护(符合部分汽车级温度要求)。
  4. 通信设备:小型基站、路由器、交换机的以太网接口、电源接口防护。

五、品牌与选型价值

SHIKUES(时科)作为国内专业保护器件厂商,SMF6.0A具备以下选型价值:

  1. 参数一致性:通过严格生产工艺控制,确保每颗器件的击穿电压、钳位电压偏差极小,批量应用时防护性能稳定。
  2. 性价比优势:在保证性能的前提下,成本竞争力强,适合中低端消费电子、工业设备的批量采购。
  3. 技术支持:提供完善的应用方案(如电路设计建议、脉冲测试方案),帮助客户快速实现防护设计。

总结

SMF6.0A是一款针对低电压系统的高性价比单向TVS,精准的电气参数、小型化封装、宽温可靠性,可有效解决5V/6V电路的瞬态过压防护问题,覆盖多领域应用,是电子系统防护设计的可靠选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.