WMSIC Electronic Components

SHIKUES MM3Z24

ModelMM3Z24
PackageSOD-323
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES MM3Z24
Type
SHIKUES
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
MM3Z24
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.029g
Electronic Component
1
(Zzk)
120Ω
(Zzt)
70Ω
Electronic Component
BM0265580752
Diode
1
Current(Ir)
50nA
Power Dissipation(Pd)
200mW
Electronic Component
22.8V~25.6V
Electronic Component
65℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MM3Z24(SHIKUES 时科)——SOD-323 封装 24.2V 稳压二极管产品概述

一、产品简介

MM3Z24 为独立式稳压(二极管)元件,标称稳压值 24.2V,允许范围 22.8V ~ 25.6V,封装为小尺寸表面贴装的 SOD-323,适合空间受限和小功率稳压/限幅场合。器件设计用于反向工作作为稳压源或电压钳位,品牌为 SHIKUES(时科)。

二、主要电气参数

  • 稳压值(标称):24.2V(典型)
  • 稳压值范围:22.8V ~ 25.6V
  • 反向漏电流 Ir:50nA(在 16.8V 时测得,表示低漏漏特性)
  • 最大耗散功率 Pd:200mW(在规定环境及散热条件下)
  • 动态阻抗:Zzt = 70Ω,Zzk = 120Ω(分别代表测试点附近的小信号阻抗指标,有助于估算负载纹波和瞬态响应)
  • 工作结温范围:-65℃ ~ +150℃

三、典型应用场景

  • 24V 轨道的小功率稳压参考或基准源
  • 输入过压钳位与保护(例如对小信号模块、ADC 输入或驱动电路进行过压保护)
  • 作为参考元件参与基于电阻分压的精密检测电路(注意动态阻抗与温漂影响)
  • 低功耗便携设备或受限空间的电源保护模块

四、设计与使用注意事项

  • 功率限制:由于 Pd 为 200mW,器件在稳压工作时允许的最大持续电流约为 200mW / 24.2V ≈ 8.26mA。为保证可靠性和余量,实际设计中建议工作电流远低于该值(例如 ≤5mA),并考虑脉冲或瞬态时的额外能量吸收能力。
  • 散热管理:SOD-323 封装散热能力有限,PCB 铜箔面积与热 vias 对于降低结温十分重要。若无具体 RθJA 数据,应通过实验或参考厂方完整数据手册计算结温上升。
  • 温度影响:高温会降低耗散能力并影响稳压点与漏电流,系统需考虑温度漂移带来的稳压偏差。结温不应超过 +150℃峰值。
  • 器件偏流与阻抗:Zzt 与 Zzk 表明在工作电流附近存在显著阻抗,对低纹波或高精度参考应慎重评估并必要时增加滤波或主动缓冲。
  • 焊接与处理:符合 SOD-323 的回流焊温度曲线,避免超过器件最大结温;操作时注意防静电、防潮保护。

五、选型建议与替代

若需要更大功率或更低动态阻抗,应考虑更大功率封装(如 SOD-123、DO-214 等)或使用专用线性稳压器/基准芯片。对于对稳压精度、温漂、噪声有较高要求的应用,可选用带温度补偿的基准源或低阻抗稳压器模块。

总结:MM3Z24(SHIKUES)以其 24.2V 标称值、SOD-323 小尺寸和低漏电流特性,适用于对体积和功耗敏感的 24V 级别保护与参考场合。设计时应重点评估功耗、散热和动态阻抗对系统性能的影响,并合理限制工作电流以保证长期可靠性。若需详细的测试曲线、热阻和封装引脚图,请参考厂家完整数据手册或联系供应商获取原始资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.