WMSIC Electronic Components

SHIKUES MMBT2222A

ModelMMBT2222A
PackageSOT-23
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES MMBT2222A
Type
SHIKUES
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
MMBT2222A
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0219532715
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
300MHz
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBT2222A 产品概述

概述

MMBT2222A是一款广泛应用于各类电子电路中的NPN型双极性晶体管(BJT),其额定功率为225mW,最大集电极电压为40V,最大集电极电流可达600mA,采用流行的SOT-23封装。由于其优异的性能和高可靠性,MMBT2222A在消费电子、通讯设备、工业控制及其他应用场景中得到了广泛应用。

主要特点

  1. 高频特性:MMBT2222A具有较高的增益带宽积,使其适合用于高频放大器和开关应用。
  2. 低饱和压降:该器件在饱和状态下表现出较低的集电极-发射极压降,能够提高能效和降低功耗。
  3. 稳定性与可靠性:符合工业标准,MMBT2222A能够在各种环境条件下稳定工作,有效提高了设计的可靠性。
  4. 易于集成:SOT-23/3封装小巧,方便在紧凑的电路板设计和高密度集成中使用。

规格参数

  • 类型:NPN
  • 额定功率:225mW
  • 最大集电极电压 (Vce):40V
  • 最大集电极电流 (Ic):600mA
  • 增益 (hFE):通常在200到600之间,具体数值与工作条件相关
  • 封装:SOT-23

应用领域

  1. 开关电路:由于其能够处理较高电流和电压,MMBT2222A常被用作电子开关,实现高效能的导通和关断。
  2. 信号放大器:在音频和其他信号处理应用中,MMBT2222A可作为小信号放大器,提升信号强度。
  3. 驱动电路:由于其高集电极电流能力,适合驱动继电器、电机和各种负载。
  4. 振荡器和定时器:可用于构建振荡器和定时器电路,实现脉冲产生及时序控制。

性能分析

  • 散热特性:虽然MMBT2222A的功率额定为225mW,但在设计时还需考虑散热问题。在高负载条件下,应采取适当的散热措施,以防止过热造成的性能下降或器件损坏。
  • 工作温度范围:MMBT2222A通常的工作温度范围为-55℃至+150℃,适应多种工作环境,确保在不同温度下的稳定性。
  • 电源管理:在电源管理电路中,利用其高增益特性,可以有效地监测和调节电源,提高电源转换效率。

结论

MMBT2222A是一款性能卓越且应用广泛的NPN型三极管,适合各种电子电路的需求。其较高的功率和电流处理能力、稳定的工作性能、以及小巧的SOT-23封装,使其在设计方案中成为必不可少的元件。随着科技的发展和应用领域的不断扩展,MMBT2222A的市场需求预计将持续增长,是设计师和工程师在选择电子元器件时的重要考量之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.