WMSIC Electronic Components

SHIKUES DFLS1100

ModelDFLS1100
PackageSOD-123FL
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES DFLS1100
Type
SHIKUES
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
DFLS1100
Electronic Component
1
Package
SOD-123FL
Electronic Component
Schottky Diode
Electronic Component
0.039g
Electronic Component
1
Electronic Component
BM0227382525
Current
1A
Diode
Electronic Component
Current(Ir)
200uA@100V
(Vf)
850mV@1A
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DFLS1100 肖特基二极管 产品概述

一、产品简介

DFLS1100 是 SHIKUES(时科)推出的一款独立式肖特基二极管,采用 SOD-123FL 小外形封装。该器件设计用于开关电源及整流场合,兼顾较高反向耐压与快速开关特性。工作结温范围为 -55℃ 至 +125℃,适应宽温度环境。

二、主要电气参数

  • 直流正向电流(IF):1A(整流电流)
  • 正向压降(Vf):0.85V @ 1A
  • 直流反向耐压(VR):100V
  • 反向电流(IR):200µA @ 100V
  • 非重复峰值浪涌电流(Ifsm):30A
  • 工作结温:-55℃ ~ +125℃
    以上参数描述了 DFLS1100 在常规整流与浪涌条件下的电气能力,100V 的耐压和 30A 的峰值浪涌使其在高压整流与输入浪涌抑制场合表现可靠。

三、热特性与散热建议

在 1A 连续正向工作时,Vf≈0.85V,器件功耗约为 0.85W。由于 SOD-123FL 为小型封装,散热路径有限,建议:

  • 在 PCB 布局上增加引脚散热铜箔和过孔以改善热蔓延;
  • 将器件靠近散热平面或外壳安装位置,避免长时间满载工作;
  • 对于高平均功率或高环境温度工况,考虑使用并联器件或选用更大封装以降低结温。

四、典型应用场景

  • 开关电源输出整流与二次侧整流;
  • DC-DC 转换器续流/钳位二极管;
  • 输入整流、反向保护与防反接电路;
  • 汽车电子(符合温度范围要求)、工业电源及充电器等需兼顾耐压与浪涌能力的场合。

五、封装与安装注意事项

DFLS1100 采用 SOD-123FL 封装,适合自动贴片生产。使用时应注意:

  • 识别极性标识并确保正确焊接方向;
  • 采用推荐的回流焊曲线,避免过高峰值温度和过长加热时间影响可靠性;
  • 存储和装配过程中按 ESD 防护规范操作,防止静电损伤。

六、选型与工程注意

DFLS1100 的特点是高耐压(100V)与较强的浪涌承受能力,适合需要高压余量的肖特基应用。但其在 1A 条件下正向压降约 0.85V,导致在高平均电流场合产生较大功耗,需权衡效率与热管理。若追求更低 Vf 或更高连续电流能力,可考虑更低 Vf 的肖特基或更大封装器件。

七、可靠性与测试建议

在设计验证阶段建议做:热阻测量、结温-环境温度测试、浪涌能力确认以及高温高压下的反向漏电测试。特别关注工作环境温度对反向漏电的影响,因为肖特基二极管的漏电随温度上升显著增加。

总结:DFLS1100 是一款面向高耐压、需抗浪涌场合的独立式肖特基二极管,适用于多种电源整流与保护应用。合理的 PCB 散热设计与负载评估可确保其在长期运行中的稳定性与可靠性。若需器件封装图、脚位尺寸或推荐 PCB 尺寸,请告知以提供更详细资料。

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