Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SHIKUES BC849C
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SHIKUES BC849C
- Type
- SHIKUES
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SHIKUES
- Electronic Component
- BC849C
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0264580605
- Operating Temperature
- 65℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 100MHz
- Power Dissipation(Pd)
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BC849C 产品概述
一、产品简介
BC849C 是一款面向通用小信号应用的 NPN 双极结晶体管，采用 SOT-23 小封装，适合便携式和空间受限的电路板设计。该器件由 SHIKUES（时科）制造，单只包装，规格稳定，适用于开关与放大等多种场合。
二、主要参数
- 晶体管类型：NPN
- 最大集电极电流 Ic：100 mA
- 集-射极击穿电压 Vceo：45 V
- 耗散功率 Pd：250 mW（环境依赖，请以厂商数据手册为准）
- 直流电流增益 hFE：约 200（典型值，随工作点变化）
- 特征频率 fT：约 100 MHz
- 集电极截止电流 Icbo：约 100 nA（低泄漏）
- 集射极饱和电压 VCE(sat)：约 300 mV（量级参考，受偏置条件影响）
- 射-基极击穿电压 Vebo：5 V
- 工作温度范围：-65 ℃ ~ +150 ℃
- 封装：SOT-23
- 数量：1 个 / 包（单件）
三、性能特点
BC849C 在低功耗小信号场合表现良好。高达 45 V 的 Vceo 和 100 mA 的 Ic 使其能胜任中低功率开关与驱动任务；hFE 约 200 和 fT ≈100 MHz 支持宽带放大与高增益电路。低集电极漏电流（Icbo≈100 nA）有利于高阻抗输入和低偏置电流的电路设计。SOT-23 封装在节省 PCB 面积的同时，热耗散有限，适合空间受限的消费电子与仪表产品。
四、典型应用
- 小信号放大：前置放大器、音频信号处理、射频前端（低功率）
- 通用开关与驱动：驱动小型继电器、指示灯、IGBT/MOSFET 驱动级的前级开关
- 电平移位、缓冲器、模拟开关控制
- 便携式设备、仪表与传感器信号调理电路
五、使用与布局建议
- 引脚排列：常见 SOT-23 封装视图（自顶向下）为 1：E、2：B、3：C；实际以厂商数据手册为准。
- 为保证稳定工作，应注意不要超出最大 Ic、Vceo 和 Pd 限值；SOT-23 封装的热阻较大，长时间高电流工作需考虑散热或降载。
- 在高速开关应用中，建议在基极串联限流电阻以控制开关速度和峰值电流，并在必要时加入基极吸收网络以抑制振铃。
- 布局上尽量缩短集电极、基极与对应驱动回路的走线，关键电容（去耦）靠近电源引脚布置以减少寄生。
- 若替换型号，请注意封装、增益、极限参数的差别（例如 BC848/BC849 系列内部规格接近，2N3904 在参数与封装上存在差异）。
六、封装与采购信息
BC849C 由 SHIKUES（时科）提供 SOT-23 小封装，常用于批量 SMT 装配。此处为单只规格说明，采购时请确认整卷或托盘包装、批次和完整数据手册以获取典型测试条件下的参数曲线与热特性数据。
备注：本文档为产品概述与使用建议，具体电气特性、引脚定义和典型曲线请以制造商正式数据手册为准。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
