WMSIC Electronic Components

SHIKUES SD103AWS

ModelSD103AWS
PackageSOD-323
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES SD103AWS
Type
SHIKUES
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
SD103AWS
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.029g
Electronic Component
1
Electronic Component
BM0226546366
Current
350mA
Diode
Electronic Component
Current(Ir)
5uA@30V
(Vf)
600mV@200mA
Electronic Component
65℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SD103AWS 肖特基二极管(SHIKUES 时科)产品概述

一、产品简介

SD103AWS 为时科(SHIKUES)出品的独立式肖特基二极管,封装为 SOD-323。器件设计用于低电压、低功率的快速整流与防反接保护,工作结温范围宽(-65℃ 至 +125℃),适合表贴小体积电路板应用。

二、主要参数

  • 正向压降(Vf):约 600 mV @ If = 200 mA
  • 直流反向耐压(Vr):40 V
  • 反向电流(Ir):≤ 5 μA @ Vr = 30 V
  • 平均整流电流:350 mA
  • 工作结温:-65 ℃ ~ +125 ℃
  • 封装:SOD-323(独立式小封装)

三、特性与优势

  • 低正向压降:在 200 mA 时 Vf ≈ 0.6 V,有利于降低导通损耗与热量产生。
  • 低漏电流:30 V 条件下 Ir ≤ 5 μA,适合对静态漏电有要求的电源与检测电路。
  • 小尺寸封装:SOD-323 占板空间小,适用于高密度 SMT 布局。
  • 宽温度范围:能在工业级温度下可靠工作,适用于多种环境。

四、典型应用

  • 低压电源整流与二次侧保护
  • 电源输入的反接保护与肖特基隔离
  • 开关电源(小功率)自由轮回路或钳位
  • 便携设备、通信模块与消费电子的小电流整流

五、使用与注意事项

  • 功率与散热:在 If = 200 mA、Vf = 0.6 V 时静态功耗约 0.12 W;在最大整流电流 350 mA 时瞬间损耗可达 ~0.21 W。实际结温上升取决于 PCB 散热与 RθJA,建议按应用场景进行热仿真并适度留有余量。
  • 温度与电流额定:长时间靠近最大整流电流时应进行降额使用,尤其在高环境温度下。
  • 焊接:遵循 SOD-323 封装的回流焊工艺规范,避免过高回流温度与超时,以防封装或焊盘应力损伤。
  • 静电与保护:肖特基结对静电较敏感,生产与测试环节建议做好 ESD 防护。

六、封装与采购建议

SOD-323 小巧且适合自动贴装。设计 PCB 时建议为器件提供足够的铜面积或散热铜箔,并按厂商推荐封装尺寸绘制焊盘。采购时请确认原厂规格书与批次一致,必要时索取样片或可靠性报告以评估在目标应用中的长期表现。

如需基于具体电路进行热设计、并联使用或替代件建议,可提供电路工况与 PCB 布局以便进一步分析。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.