WMSIC Electronic Components

SHIKUES 2SD1624

Model2SD1624
PackageSOT-89
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES 2SD1624
Type
SHIKUES
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
2SD1624
Electronic Component
1
Package
SOT-89
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.138g
Electronic Component
1
Electronic Component
BM0264580595
Transistor Type
NPN
Frequency(f T)
50MHz
Power Dissipation(Pd)
2.5W
Electronic Component
Electronic Component
Electronic Component
1000
Collector Current(Ic)
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SD1624 产品概述

概要

2SD1624 是一种由 SHIKUES(时科)制造的高性能 NPN 双极晶体管(BJT),适用于各种电子设备和系统中的功率放大和开关应用。以下是对这个产品的详细介绍。

基础参数

  • 功率(Pd): 2.5W
    • 这表明该晶体管在正常操作条件下可以承受的最大功率,确保其在高负载情况下不会过热或损坏。
  • 商品分类: 三极管(BJT)
    • 作为一种基本的电子元器件,三极管广泛用于放大和开关电路。
  • 晶体管类型: NPN
    • NPN 型三极管是最常见的一种类型,适用于多种应用场景,包括音频和射频放大、开关电路等。
  • 特征频率(fT): 50MHz
    • 特征频率是指在特定条件下,晶体管的电流增益下降到1时的频率。对于 2SD1624 来说,其 50MHz 的特征频率表明它适合中频到高频范围内的应用。
  • 直流电流增益(hFE@Ic,Vce): 32@100mA, 2V
    • 电流增益是指集电极电流与基极电流的比值。在 100mA 的集电极电流和 2V 的集电极-发射极电压下,hFE 为 32,这意味着该晶体管具有良好的放大能力。
  • 集射极击穿电压(Vceo): 30V
    • 这是指在基极短路到发射极时,集电极和发射极之间允许的最大电压。30V 的击穿电压提供了足够的安全裕度,防止因过压而导致损坏。
  • 集电极-发射极饱和电压(VCE(sat)@Ic,Ib): 500mV@2A, 0.2A
    • 饱和电压是指当晶体管完全导通时,集电极和发射极之间的电压。在 2A 的集电极电流和 0.2A 的基极电流下,饱和电压仅为 500mV,这表明该晶体管在开关状态下具有低损耗。
  • 集电极截止电流(Icbo): 1uA
    • 截止电流是指在基极短路到发射极且无外部驱动信号时,集电极的漏电流。1uA 的截止电流非常小,表明该晶体管在关闭状态下具有良好的隔离性。
  • 集电极电流(Ic): 3A
    • 这是指该晶体管能够承受的最大连续工作集电极电流。3A 的集电极电流使其适合于中到高功率的应用场景。

应用场景

2SD1624 因其优异的性能参数,广泛适用于以下几个领域:

  • 音频放大器
    • 由于其高电流增益和低饱和电压,2SD1624 非常适合用于音频功率放大器中,能够提供清晰且高质量的声音输出。
  • 射频放大器
    • 其 50MHz 的特征频率使得它也可以用于中频到高频范围内的射频放大应用,如无线通信设备或广播系统。
  • 开关电路
    • 低饱和电压和高集电极电流能力使得 2SD1624 非常适合用于各种开关应用,如电源管理、继电器驱动等。
  • 工业控制系统
    • 在工业控制系统中,2SD1624 可以用于驱动大型负载,如电机、阀门等,提供可靠的控制和操作。

包装和尺寸

2SD1624 采用 SOT-89-3 封装,这是一种小型化的封装形式,非常适合于空间有限但需要高性能的应用场景。这种封装形式不仅节省空间,还能提高散热效率,确保设备在高负载条件下保持稳定运行。

使用注意事项

在使用 2SD1624 时,需要注意以下几点:

  • 过热保护
    • 确保设备有适当的散热措施,以防止过热导致损坏。
  • 电压限制
    • 不要超过最大允许的集射极击穿电压(30V),以避免因过压而导致损坏。
  • 电流限制
    • 确保集电极电流不超过最大允许值(3A),以防止因过流而导致损坏。

总结

2SD1624 是一款高性能 NPN 三极管,具有优异的电流增益、低饱和电压和高集电极电流能力。其广泛适用于音频放大、射频放大、开关电路以及工业控制系统等多种应用场景。通过选择 2SD1624,您可以构建高效、可靠且性能卓越的电子系统。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.