WMSIC Electronic Components

SHIKUES SBLC05CI

ModelSBLC05CI
PackageSOD-323
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES SBLC05CI
Type
SHIKUES
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
SBLC05CI
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.032g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
5pF
Electronic Component
BM0228038149
Operating Temperature
55℃~+125℃
Voltage
9.8V;18.3V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SBLC05CI(SOD-323)产品概述

一、产品简介

SBLC05CI 是时科(SHIKUES)推出的一款小封装、高速响应的双向瞬态电压抑制(TVS)二极管,采用 SOD-323 封装,专为对抗电磁兼容(EMC)环境下的静电放电(ESD)和快速瞬态脉冲(EFT)而设计。该器件具有低结电容(Cj≈5 pF)、较低钳位电压和较高峰值脉冲功率,适用于高速数据接口和敏感信号线的保护。

二、主要参数(典型/最大值)

  • 极性:双向(Bidirectional)
  • 工作反向截止电压 Vrwm:5 V
  • 击穿电压(Vbr):约 6 V
  • 钳位电压(Vc):9.8 V;18.3 V(由测试条件或不同测量点给出,详见完整数据手册)
  • 峰值脉冲电流 Ipp:8 A
  • 峰值脉冲功率 Ppp:250 W
  • 反向漏电流 Ir:8 µA
  • 结电容 Cj:≈5 pF(适合高速信号线)
  • 通道数:单路
  • 工作温度:-55 ℃ ~ +125 ℃
  • 抗扰度标准:符合 IEC 61000-4-2(ESD)与 IEC 61000-4-4(EFT)要求
  • 封装:SOD-323

三、主要特性与优势

  • 小型封装:SOD-323 占板面积小,适合空间受限的便携设备和紧凑型 PCB 设计。
  • 低结电容:约 5 pF,适用于 USB、HDMI、Ethernet、串行接口等高速数据线,能有效减小信号畸变与带宽损失。
  • 双向保护:对正负极性瞬态脉冲均能有效钳制,方便用于差分或无明显参考地的接口保护。
  • 高能量吸收能力:250 W 峰值脉冲功率和 8 A 峰值脉冲电流,能承受常见的静电和浪涌事件。
  • 宽温度范围与可靠性:-55 ℃ 到 +125 ℃ 的工作温度,适应工业级环境。

四、典型应用场景

  • USB、HDMI、DisplayPort 等高速数据接口的输入端保护;
  • 手机、平板、可穿戴设备等便携产品的接口防护;
  • 工业控制通信线路、传感器接口的浪涌和静电防护;
  • 以太网端口、串口(RS‑232/RS‑485)等需要双向保护的线路;
  • PCB 上靠近外部连接器的局部过压保护。

五、安装与布局建议

  • 放置位置:尽量靠近被保护的连接器/接口,引脚到保护器之间走线最短以降低寄生感抗与电感环路。
  • 接地处理:若电路为单端并联接地结构,确保接地平面良好、回流通路短且阻抗低。双向差分线路可直接跨接于两线间。
  • 焊接与回流:SOD-323 为常见贴片封装,推荐采用标准回流焊工艺,遵循元件制造商提供的焊接温度曲线与峰值温度限制。
  • ESD 操作注意:元件在存储和装配过程中仍需遵守 ESD 管理规程(佩戴防静电腕带、使用防静电包装等)。

六、可靠性与规范

SBLC05CI 针对 IEC 61000-4-2(接触/空气放电)和 IEC 61000-4-4(快速瞬变脉冲)等抗扰度要求进行了设计与测试,可在典型的现场静电与脉冲干扰情况下提供保护。具体通过等级、试验电平与次数请参照厂方完整测试报告和数据手册以获得设计保证。

七、选型与注意事项

  • 确认保护电压窗口:Vrwm = 5 V、Vbr ≈ 6 V,确保与被保护电路的最大工作电压兼容;
  • 钳位电压取决于脉冲电流和测试条件,关键应用请以数据手册中的 Vc(对应 Ipp)作为设计依据;
  • 若用于更高能量或更低钳位要求的场合,可考虑并联或选择功率更高的 TVS 型号;
  • 采购与编号示例:SBLC05CI — SHIKUES(时科),封装 SOD-323。

如需更详细的电气特性曲线、浪涌试验条件、封装尺寸或参考应用电路图,我可以基于厂方数据手册为您进一步整理。

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