WMSIC Electronic Components

Sunway SC0603J5601F2BNRH

ModelSC0603J5601F2BNRH
Package0603
BrandSUNWAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 164886

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunway SC0603J5601F2BNRH
Type
SUNWAY
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
SUNWAY
Electronic Component
SC0603J5601F2BNRH
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.023g
Electronic Component
5.6kΩ
Electronic Component
10
Electronic Component
BM0266186746
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SC0603J5601F2BNRH 贴片厚膜电阻产品概述

一、基本参数与封装规格

SC0603J5601F2BNRH是Sunway(信维通信)推出的0603封装贴片厚膜电阻,核心参数精准匹配通用电路设计需求:

  • 电阻类型:厚膜电阻(采用厚膜印刷工艺,兼顾稳定性与成本优势)
  • 阻值:5.6kΩ(对应电阻编码逻辑,实际阻值符合5.6kΩ的电路设计需求)
  • 精度:±5%(满足中精度电路的阻值匹配要求,无需额外校准)
  • 功率:100mW(低功耗设计,适配电池供电或小型化设备)
  • 工作电压:75V(电气耐压符合通用低压电路安全标准)
  • 温度系数:±100ppm/℃(温度变化对阻值影响极小)
  • 工作温度范围:-55℃~+155℃(覆盖工业、汽车等场景的极端温区)
  • 封装尺寸:0603(英制0603=公制1608mm,体积小巧,支持高密度贴装)

二、核心性能特点

  1. 宽温区阻值稳定性
    ±100ppm/℃的温度系数是核心优势:当环境温度变化100℃时,阻值漂移仅为0.01%,能在-55℃(低温存储/工作)至+155℃(高温环境如汽车发动机舱周边)的范围内保持一致性能,避免电路参数偏移。

  2. 小体积高密度贴装
    0603封装体积仅1.6mm×0.8mm,厚度约0.45mm,适合智能手机、智能穿戴、小型传感器等空间苛刻的设备,可实现PCB板高密度布局,提升产品集成度。

  3. 低功耗电气匹配性
    100mW额定功率与75V工作电压匹配,覆盖大多数低功耗电路需求(如MCU周边电阻、传感器信号调理),无需额外降额设计即可稳定工作,简化电路设计流程。

  4. 厚膜工艺可靠性
    厚膜印刷工艺制备的电阻层,相比薄膜电阻成本更低,相比线绕电阻体积更小;同时抗脉冲能力较强,能承受短时间过流冲击,延长电路使用寿命。

三、典型应用场景

该产品因参数均衡、体积小巧,广泛应用于以下领域:

  1. 消费电子:智能手机、平板的电源管理模块(分压、限流)、智能穿戴的传感器电路(信号调理);
  2. 工业控制:小型PLC模块、温度传感器接口电路(-55℃~+155℃温区适配);
  3. 汽车电子:车载辅助系统(倒车雷达、胎压监测)的低功耗控制电路;
  4. 通信设备:基站小型射频模块、终端设备的信号滤波电路;
  5. 物联网:传感器节点(温湿度传感器)、低功耗MCU周边电路(分压、上拉/下拉)。

四、可靠性与环境适应性

  1. 温度循环耐受性
    经过-55℃~+155℃温度循环测试(循环次数符合行业标准),阻值变化率≤0.5%,满足长期高低温交替环境下的稳定工作;

  2. 抗湿与机械稳定性
    封装采用抗潮环氧树脂,抵御湿度变化(沿海、潮湿工业环境);0603封装贴片强度符合IEC 60068-2-6振动测试标准,抗振动冲击能力满足消费电子与工业设备需求;

  3. 电气耐久性
    额定功率下连续工作1000小时,阻值变化率≤1%,符合Sunway品质管控要求。

五、品牌与品质保障

Sunway(信维通信)是国内射频与电子元器件龙头企业,该产品具备完善品质保障:

  • 符合RoHS 2.0、REACH环保标准,无铅无卤;
  • 生产通过ISO 9001、IATF 16949(汽车级)认证;
  • 每批次全参数测试(阻值、精度、温度系数、功率特性),确保一致性;
  • 提供技术支持与售后保障,满足客户批量采购需求。

该产品以均衡的性能、可靠的品质,成为消费电子、工业、汽车等领域通用电路的优选电阻元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.