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Slkor SS1060B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Slkor SS1060B
- Type
- SLKOR
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SLKOR
- Electronic Component
- SS1060B
- Electronic Component
- 1
- Package
- SMB
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.19g
- Electronic Component
- 1
- Electronic Component
- BM0264567861
- Current
- 10A
- Diode
- 1
- Current(Ir)
- 100nA@60V
- (Vf)
- 700mV@10A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS1060B 产品概述
一、概述
SS1060B 是 Slkor（萨科微）推出的一颗通用整流二极管，采用 SMB（DO-214AA）封装，单只独立器件设计。器件主打低正向压降与大整流电流能力，方便表面贴装（SMT）生产线的拾取与贴装，适合需要高效率整流和可靠耐压的电源应用。
二、主要电气参数
- 正向压降 Vf：约 700 mV @ 10 A，低压降有利于降低导通损耗与发热。
- 直流反向耐压 Vr：60 V，满足中低电压整流及阻断需求。
- 整流电流：10 A（连续），适用于中大电流输出整流。
- 反向漏电流 Ir：100 nA @ 60 V（典型/上限），在关断状态下保持较低泄漏，利于保持高效率与低静态损耗。
- 工作结温范围：-55 ℃ 至 +150 ℃，可在较宽温度范围内稳定工作。
三、热特性与可靠性
SMB 封装配合 10 A 的整流能力，要求合理的 PCB 散热设计。建议在器件底部和周围增加铜箔面积并布置散热过孔，以降低结温并延长寿命。尽管结温额定可达 +150 ℃，为保证长期可靠性和稳定性，实际应用中建议在高负载条件下进行温升评估并适当降额。
四、封装与装配
SMB 表面贴装封装，外形适合自动化拾取与回流焊流程，器件上设计有应力消除结构，降低热循环和机械应力造成的焊点故障风险。兼容常见的回流焊工艺，推荐按照 PCB 制造与回流曲线规范控制峰值温度和时间，以免影响器件性能。
五、典型应用场景
- 开关电源整流与续流二极管（例如降压、升压转换器输出）
- 电池管理与充电电路的反向保护或整流
- 电机驱动、LED 驱动等中大电流应用
- 通用电源滤波与整流模块
六、选型建议与注意事项
选型时应考虑工作电流峰值、脉冲特性与散热条件；若存在高频反复开关或脉冲电流，需验证峰值寿命与寄生参数。注意器件反向耐压为 60 V，超过该电压会导致击穿失效；长时间高温运行或频繁热循环应采取降额或加强散热措施。最终使用前建议在目标应用系统下进行试验验证，确认热性能与可靠性符合设计要求。
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