WMSIC Electronic Components

Slkor S9013

ModelS9013
PackageSOT-23
BrandSLKOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Slkor S9013
Type
SLKOR
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SLKOR
Electronic Component
S9013
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0228146943
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
150MHz
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S9013(Slkor 萨科微)产品概述

一、产品简介

S9013 是一款小功率 NPN 晶体管,封装为 SOT-23,适用于低电压、小信号放大与开关场合。典型额定参数为:集电极电流 Ic = 500 mA,集—射极击穿电压 Vceo = 25 V,耗散功率 Pd = 300 mW,特征频率 fT ≈ 150 MHz,集电极截止电流 Icbo = 100 nA,集—射极饱和电压 VCE(sat) ≈ 600 mV(在 500 mA 与 50 mA 条件下均给出),射—基极击穿电压 Vebo = 5 V,工作温度范围 -55 ℃ ~ +150 ℃。本产品单颗供货,品牌为 Slkor(萨科微)。

二、主要电气特性(要点)

  • 最大集电极电流:500 mA(短时或受热限)
  • 最大集—射极电压:25 V,适合低电压电源系统
  • 最大耗散功率:300 mW,SOT-23 封装受限需注意散热
  • fT≈150 MHz,适合中频小信号放大应用
  • 漏(截止)电流低:Icbo≈100 nA,利于高阻输入电路
  • VCE(sat)≈600 mV:开关导通时仍有较明显压降,导通损耗不可忽视

(注:具体典型/极限值请以原厂完整数据表为准)

三、应用场景与适用性

S9013 适合用作:

  • 小信号放大器(前置放大、音频前级、射频前端的中频段)
  • 低电压开关与驱动(继电器驱动、LED 驱动的低电流场合)
  • 电平转换、接口驱动、通断控制等通用场景

注意:当工作电流接近 500 mA 时,晶体管在导通状态下的功耗 P = Ic × VCE(sat) ≈ 0.5 A × 0.6 V = 0.3 W,已等于器件额定 Pd 值,长期工作需谨慎,建议留有热裕量或采用并联/替代方案(例如功率 MOSFET 或更大功率的晶体管)。

四、设计与使用建议

  • 驱动需求:为确保进入饱和,需提供足够基极电流。常用经验是采用“强迫 β”法(如 βsat≈10),但对于 500 mA 的负载这会需要较大的基极电流,通常不适合直接由 MCU 输出口驱动,建议使用驱动级或选择低 Rds(on) MOSFET。
  • 散热管理:SOT-23 封装散热能力有限,应通过 PCB 增大铜箔面积、使用散热板或缩短导热路径来降低结温,必要时降低占空比或使用更大封装器件。
  • 工作裕量:尽量不在最大额定值下长时间工作,设计时留 20%~50% 的裕量以延长可靠性。
  • 电路保护:考虑在基极串联限流电阻、防反接二极管或保护电路以防止 Vebo、Vceo 被意外超过。

五、封装与选型注意

SOT-23 小型封装适合体积受限的消费电子与便携设备。选型时请确认:

  • 引脚排列(不同厂商引脚定义可能有差异),装配前查看原厂引脚图;
  • 生产批次与封装标识,确认 Slkor(萨科微)原厂或授权分销渠道以保证质量;
  • 若电流、功耗或热管理要求较高,可考虑更大封装或功率 MOSFET 替代方案。

结语:S9013(Slkor)以其较高的 fT 与中等电流能力,适合多种低压小信号与开关应用,但在接近 500 mA 工作点时需严格关注热设计与驱动方案,确保器件的长期可靠性与稳定性。请在最终设计中参考完整数据手册并进行实际功耗与温升验证。

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