WMSIC Electronic Components

Slkor SL05N06Z

ModelSL05N06Z
PackageSOT-89
BrandSLKOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Slkor SL05N06Z
Type
SLKOR
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SLKOR
Electronic Component
SL05N06Z
Electronic Component
1
Package
SOT-89
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.17g
Electronic Component
1
Electronic Component
BM0227676507
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
500mW
Electronic Component
Electronic Component
Electronic Component
1000
Voltage(Vdss)
60V
Capacitor(Ciss)
400pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SL05N06Z 产品概述

SL05N06Z 是 Slkor(萨科微)推出的一款 SOT-89 封装 N 沟道场效应管,针对小功率开关与电源管理应用进行优化。器件主要参数包括:Vdss = 60V,Id = 5A,RDS(on) = 58mΩ @ VGS=10V(70mΩ @ 4.5V),最大耗散功率 Pd = 500mW,门极总电荷 Qg ≈ 9nC(@10V),输入电容 Ciss = 400pF,反向传输电容 Crss = 23pF,输出电容 Coss = 28pF,工作温度范围 -55℃ ~ +150℃,门限电压 Vgs(th) ≈ 1.7V。

一、主要性能亮点

  • 60V 耐压,适用于中等电压的开关场合。
  • 低导通电阻:58mΩ(10V 驱动)在同类 SOT-89 器件中具有较好的导通性能,能够在低压降场景减少导通损耗。
  • 小体积封装(SOT-89),适合空间受限的电源模块与功率路径设计。
  • 低门极电荷(9nC)和中等 Ciss,使其在中低频开关应用中切换损耗可控且驱动要求不高。

二、热与电流注意事项

标称连续漏极电流 5A 为器件在理想条件(如良好散热、严格的铜箔面积或基板热沉条件下)的参考值。由于 SOT-89 的热阻相对较高,实际 PCB 使用时必须严格热设计并做降额:

  • 导通损耗示例:I=2A 时 Pcond = I^2·RDS(on) ≈ 0.232W;I=5A 时 Pcond ≈ 1.45W,已远超 Pd=0.5W,所以不建议在无额外散热措施下长时间以 5A 工作。
  • 建议增大铜箔面积、使用底层散热通孔或将器件靠近金属散热块以提高散热能力,并依据器件数据手册中的 RθJA 计算允许的电流与功耗。

三、驱动与开关特性

  • Qg=9nC(@10V)表示门极驱动能量较低,例如充放电能量约为 Qg·Vgs ≈ 90nJ/次(10V 驱动),在数十到数百 kHz 的切换频率下,门极驱动功耗并不显著,但若频率更高或驱动电压更大应考虑驱动器能力及热耗。
  • Crss = 23pF 与 Coss = 28pF 决定了开关时的米勒效应与能量回收特性,设计缓冲网络或米勒电阻时应结合实际开关速度与电感环境优化。

四、典型应用场景

  • 低压侧开关管(DC-DC 降压/升压转换器低侧)
  • 电池保护与电源选择开关
  • LED 驱动与小功率电机驱动(需热管理)
  • 便携设备电源管理、电源分离与反向保护电路

五、PCB 布局与实用建议

  • 尽量缩短漏源回流路径,减小电感与电阻产生的额外损耗与电磁干扰。
  • 增大器件周围铜箔面积并考虑通过孔改善层间散热;若可能,在底层增加散热层或使用散热垫。
  • 对于开关应用,建议在门极增加一定阻值(如 10Ω–100Ω)以抑制振铃,并在漏源侧并联合适的续流二极管或 RC 吸收网络来缓冲开关过冲。
  • 严格按照系统工作温度对器件进行降额设计,保证长期可靠性。

六、总结

SL05N06Z 在 60V 电压等级下提供了较低的导通电阻与紧凑的 SOT-89 封装,适合空间受限且对导通损耗有要求的中低功率开关与电源管理应用。设计时应重点关注器件的热散能力与开关布局,并基于实际 PCB 散热条件对最大电流进行合理降额,从而发挥器件最佳性能并保证可靠性。若需更精确的热计算或电路参考,请参照厂商详细数据手册与热阻参数。

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