WMSIC Electronic Components

Slkor SLESD0501CU

ModelSLESD0501CU
PackageDFN1006
BrandSLKOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Slkor SLESD0501CU
Type
SLKOR
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SLKOR
Electronic Component
SLESD0501CU
Electronic Component
1
Package
DFN1006
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
3pF
Electronic Component
BM0265592378
Voltage
14V
Current(Ir)
1uA
Voltage(VBR)
9.4V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SLESD0501CU ESD防护器件产品概述

一、产品定位与核心功能

SLESD0501CU是Slkor(萨科微)推出的双向瞬态抑制二极管(TVS)型ESD防护器件,专为低电压电子设备的信号线路设计,核心作用是在系统遭遇静电放电(ESD)或瞬态过压时,快速导通并钳位电压至安全范围,避免后端敏感元器件(如MCU、传感器、接口芯片等)因过压损坏,同时保持正常信号传输的完整性。该器件适配5V工作电压系统,是消费电子、可穿戴设备等领域的主流防护方案之一。

二、关键电气参数解析

器件的核心参数直接决定防护性能与应用适配性,关键参数及实际意义如下:

(1)防护电压核心参数

  • 反向截止电压(Vrwm):5V
    正常工作时的最大反向耐压,即信号线路电压≤5V时,器件处于截止状态,不干扰信号传输。
  • 击穿电压(Vbr):9.4V
    过压触发阈值——当线路电压超过该值时,器件快速击穿导通,启动防护功能,避免电压持续上升。
  • 钳位电压(Vc):14V
    瞬态脉冲下的最终钳位电压,确保后端敏感元件的输入电压不超过其最大耐受值(通常敏感芯片过压阈值≤10V),从源头避免损坏。

(2)脉冲耐受能力

  • 峰值脉冲功率(Ppp):28W@8/20μs
    采用国际标准8/20μs脉冲波形(上升沿8μs、半峰值时间20μs)时,器件可承受的最大脉冲功率,对应峰值电流约2A(Ipp=Ppp/Vc≈28W/14V),能有效抑制常见ESD脉冲(如HBM 8kV、MM 400V等)。

(3)信号兼容性参数

  • 反向漏电流(Ir):1μA(典型值)
    正常工作时漏电流极小,不增加系统功耗,也不会影响信号的直流偏置,适配低功耗设备需求。
  • 结电容(Cj):3pF
    低结电容设计对高频信号(如USB 2.0/3.0、HDMI、音频信号)的传输损耗极小,避免信号失真或速率下降,适配高速接口防护。

(4)通道与极性

  • 通道数:单路
    适用于单条信号线路的独立防护;极性:双向
    无需区分信号正负极,设计时无需额外匹配极性,简化PCB布局与研发流程。

三、封装与典型应用场景

(1)封装特性

采用DFN1006封装(尺寸1.0mm×0.6mm×0.5mm),属于超小型无引脚封装,具有三大优势:

  • 占用PCB空间极小,适配当前电子设备“轻薄化”趋势;
  • 无引脚设计降低寄生电感,提升高频防护性能;
  • 散热性能良好,能快速 dissipate 瞬态脉冲能量,延长器件寿命。

(2)典型应用场景

因低容、小封装、双向防护的特点,该器件广泛应用于:

  • 移动终端:智能手机、平板电脑的USB接口、耳机孔、SIM卡槽防护;
  • 可穿戴设备:智能手表、手环的传感器接口、充电接口防护;
  • IoT设备:智能家居传感器、智能门锁的WiFi/蓝牙通信接口防护;
  • 消费电子:蓝牙耳机、便携式音箱的音频接口、充电线路防护。

四、产品优势与市场价值

SLESD0501CU相比同类产品,核心优势突出:

  1. 双向防护简化设计:无需区分极性,减少设计错误风险,缩短研发周期;
  2. 低容兼容高速信号:3pF结电容满足USB 3.0(2.5Gbps)、HDMI 1.4等高速接口传输要求;
  3. 小封装适配小型化:DFN1006封装适合高密度PCB布局,适配轻薄设备需求;
  4. 高可靠防护性能:28W脉冲功率覆盖绝大多数消费电子ESD防护需求,降低产品返修率。

该器件为Slkor主流ESD防护产品,性价比突出,已被国内多家消费电子厂商用于量产,为电子设备提供稳定可靠的静电防护解决方案。

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