Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SSP61CC3302MR 是上海矽朋(Siproin)推出的一款单路电压检测与复位芯片,用于对 3.3V 电源轨进行可靠监控。器件工作电压范围广(0.7V ~ 10V),输入耐受范围达 -300mV ~ 8V,工作温度 -30℃ ~ +80℃,封装为常见的 SOT-23,输出采用推挽结构,便于直接驱动后级逻辑或指示器件。
当被监控电压低于内部阈值(3.3V)时,芯片会产生复位信号以保证系统进入受控复位态,防止 MCU 或外围逻辑在电源不稳定时误动作。推挽输出能直接驱动复位线或指示 LED;当电压恢复超过阈值并稳定后,芯片释放复位,允许系统正常启动。关于复位保持时间、阈值精度和延迟等时序特性,请在设计前参考完整规格书。
SSP61CC3302MR 提供 SOT-23 封装,体积小、易于 PCB 布局。推挽输出便于直接连入复位线或驱动下一级逻辑。具体引脚定义、引脚功能和典型应用电路请参见厂方数据手册以取得准确接线与尺寸信息。
品牌:Siproin(上海矽朋);型号:SSP61CC3302MR;封装:SOT-23。建议在量产前索取并确认官方数据手册,关注阈值精度、复位保持时间和包封检验报告,以确保在目标应用环境下满足可靠性与规范要求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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