WMSIC Electronic Components

Siproin SSP61CC4002MR

ModelSSP61CC4002MR
PackageSOT-23
BrandSIPROIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Siproin SSP61CC4002MR
Type
SIPROIN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SIPROIN
Electronic Component
SSP61CC4002MR
Electronic Component
1
Package
SOT-23
Electronic Component
Supervisorand positions IC
Electronic Component
0.12g
Electronic Component
1
Electronic Component
BM0228537433
Operating Temperature
30℃~+80℃
Operating Voltage
700mV~8V
ICType
Voltage Detector
Output Type
Electronic Component
Voltage
4V
Supervisor Voltage
1
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SSP61CC4002MR 产品概述

一、主要特性

SSP61CC4002MR 是上海矽朋(Siproin)推出的一款单路电压检测与复位芯片,适用于对单个电源轨进行欠压监测并输出复位信号。核心参数如下:

  • 芯片类型:电压检测器(监控与复位)
  • 输出类型:推挽输出(Push‑Pull),可直接驱动数字复位输入
  • 工作电压范围:约 0.7V ~ 8V
  • 检测阈值:4.0V(用于判断供电是否低于设定值)
  • 受监控电压数:1 路
  • 工作温度范围:-30℃ ~ +80℃
  • 封装:SOT‑23(小封装,便于体积受限的应用)
  • 品牌:Siproin(上海矽朋)

二、功能简介

SSP61CC4002MR 在被监控电源电压低于 4.0V 时会切换输出状态,用以通知上层系统(例如 MCU、DSP 或其它数字电路)进入复位或受控状态。推挽输出结构既能源端拉高也能拉低,减少外部上拉/下拉器件的需求,便于直接与控制器的复位引脚或逻辑电平接口相连。

该器件设计用于提高系统电源稳定性与上电/欠压时的确定性行为,避免在电压异常时系统工作于不确定状态导致数据损坏或功能异常。

三、典型应用场景

  • 单电源微控制器(MCU)/处理器复位电路
  • 电池供电设备的欠压保护与复位管理(移动设备、穿戴、远程终端等)
  • 电源管理与电源序列控制(开机/关机监控)
  • 工业控制和消费电子产品中对关键电源轨的可靠监测

四、封装与环境适应性

SSP61CC4002MR 提供 SOT‑23 小封装,适合表面贴装工艺(SMT),有利于降低占板面积与组装成本。器件的工作温度覆盖 -30℃ 到 +80℃,可满足许多商业级和轻工业应用的环境需求。

五、设计建议与注意事项

  • 建议在 VCC 与 GND 之间靠近芯片处放置 0.1µF 陶瓷去耦电容,以抑制电源瞬态干扰,提高监测精度与稳定性。
  • 由于为推挽输出,通常可直接连接至 MCU 复位引脚;若需与开漏电平或多设备共享线,应根据系统需求增加适当的接口电路。
  • 在电源瞬态或反向注入可能出现的场景下,注意电源引脚的布局和滤波,确保器件不会因短时脉冲误动作。
  • 请参考厂方完整数据手册以确认阈值容差、漂移、延时特性和最大允许绝对电压等详细参数,便于在严苛环境或精密系统中正确选型与布线。

六、订购与支持

SSP61CC4002MR 由上海矽朋(Siproin)生产,SOT‑23 封装适合大批量生产与自动化贴装。购买与技术支持建议通过正规分销渠道或直接联系厂商,以获取最新的规格书、样品与应用指导。

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