WMSIC Electronic Components

Siproin SSP7903P33JR

ModelSSP7903P33JR
PackageTO-252
BrandSIPROIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Siproin SSP7903P33JR
Type
SIPROIN
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
1.5V@(1A)
Electronic Component
SIPROIN
Electronic Component
SSP7903P33JR
Electronic Component
1
Package
TO-252
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.5g
Electronic Component
1
Electronic Component
BM0227783251
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
40V
Output
Electronic Component
Output Voltage
3.3V
Output Current
1A
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SSP7903P33JR — 40V/1A 线性稳压器(LDO)产品概述

一、产品简介

SSP7903P33JR 是上海矽朋(Siproin)推出的一款高输入电压、低静态电流的固定输出线性稳压器(LDO),输出为 3.3V,最大输出电流 1A。器件支持最高 40V 工作电压,适合需要从高电压源降压到 3.3V 的应用场景,兼顾低功耗与高抗干扰能力,封装为 TO-252(DPAK),便于表面贴装及散热处理。

二、主要规格亮点

  • 输出类型:固定(3.3V)
  • 输入电压上限:40V(最大工作电压)
  • 输出电流:1A(最大)
  • 压降(Dropout):1.5V @ 1A
  • 静态电流(Iq):典型 2µA(空载/待机态低耗)
  • 电源纹波抑制比(PSRR):54.5dB @ 1kHz
  • 保护功能:过热保护、过流保护、短路保护
  • 工作温度范围:-40℃ ~ +85℃(Ta)
  • 输出极性:正极,单通道输出
  • 封装:TO-252(便于 PCB 散热设计)

三、保护与可靠性

SSP7903P33JR 内置多重保护机制:当输出被短路或过流时,限流电路限制电流以保护器件;过温保护(Thermal Shutdown)在芯片温度异常升高时自动关断,待温度下降后自动恢复,增强系统可靠性。这些功能使器件适用于存在瞬态负载或异常工况的工业与商业产品。

四、典型应用场景

  • 工业控制与测控设备(高压供电到 3.3V 节点)
  • 通信设备与基站外围电源模块
  • 仪器仪表与传感器供电(长时间待机、低静态电流)
  • 车载电子(需注意具体电磁兼容与峰值浪涌规范)
  • 消费电子中的高压降压点(需评估功耗与散热)

五、应用与布局注意事项

  • 输入电容:在 LDO 输入端紧贴芯片放置低 ESR 电容(建议 10µF 陶瓷或钽电容),以抑制输入瞬态与确保稳压器稳定性。
  • 输出电容:输出端建议并联低 ESR 电容(10µF~22µF),部分设计对 ESR 有特定要求,请参照器件数据手册选型。
  • 布局:输入/输出走线尽量短且粗,GND 应连接到同一地平面并避免回流环路,TO-252 的散热片/焊盘应与大面积铜箔相连以增强散热。
  • 热设计:在高 Vin 且输出大电流工作时,功耗 = (Vin - 3.3V) × Iout,需评估 PCB 热阻并采取散热措施,必要时加装散热铜箔或额外散热片。
  • 电磁兼容:若应用在需要严格 EMC 的环境,建议在输入侧增加 TVS 二极管及滤波电路以应对浪涌与瞬态脉冲。

六、封装与引脚(概述)

TO-252(DPAK)封装适合表面贴装与热量经焊盘传导至 PCB。常见引脚功能包括 VIN、GND、VOUT,具体引脚排列及焊盘尺寸请参阅 SSP7903P33JR 的器件封装图与 PCB 布局示意图。

七、典型外接电路(建议)

  • VIN ——||—— LDO VIN
    (靠近 VIN 放置 10µF 陶瓷电容)
  • LDO VOUT ——||—— 10~22µF 低 ESR 电容 —— 负载
  • GND —— 地平面(尽量短线连接)

总结:SSP7903P33JR 将高输入耐受能力、1A 输出能力与超低静态电流相结合,适合从高电压源稳定供电到 3.3V 的应用,凭借其多重保护和良好 PSRR,在工业与消费领域均具备广泛应用价值。详细电气特性、引脚定义和 PCB 设计规范请参考产品完整数据手册。

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