WMSIC Electronic Components

Siproin H7530-H# H7530

ModelH7530-H#
PackageSOT-23-3
BrandSIPROIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Siproin H7530-H#
Type
SIPROIN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
600mV@(100mA)
Electronic Component
SIPROIN
Electronic Component
100uVrms
Electronic Component
H7530-H#
Electronic Component
1
Package
SOT-23-3
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.08g
Electronic Component
1
Electronic Component
BM0230804194
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
40V
Output
Electronic Component
Output Voltage
3V
Output Current
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

H7530-H# 产品概述

一、产品简介

H7530-H# 是上海矽朋(Siproin)推出的一款高压、低功耗固定输出线性稳压器(LDO),输出电压为 3.0V,最大输出电流 100mA,支持高达 40V 的输入电压。器件采用 SOT-89-3 小封装,集成热关断保护,适合对噪声、纹波抑制和待机功耗有严格要求的便携与工业应用。

二、主要性能特点

  • 固定输出:3.0V,正极输出,单通道设计。
  • 输入耐压:最高 40V,适合高压降压场景(需注意功耗与散热)。
  • 输出电流:最大 100mA,600mV 压差(在 100mA 时),因此最低输入电压应高于约 3.6V。
  • 低静态电流:Iq = 4.2μA,适用于电池供电或低功耗待机设计。
  • 优良纹波抑制:PSRR = 60dB @100Hz,能有效抑制低频电源纹波。
  • 低噪声:100μVrms(典型),适合模拟前端与精密传感器供电。
  • 保护功能:内置热关断,提升系统可靠性。
  • 封装:SOT-89-3,便于 PCB 小面积布局。

三、设计要点与建议

  • 输入/输出电容:为保证稳压器稳定与瞬态响应,建议在输入端与输出端分别放置适当的去耦电容。常见做法为输入端选择 0.1μF1μF 的陶瓷电容,输出端采用 1μF10μF 低 ESR 陶瓷或钽电容(具体容量及 ESR 需参考系統评估)。
  • 最低输入电压:由于压差(Dropout)在最大负载时约 600mV,设计时应保证 Vin ≥ Vout + Vdrop(典型场景 Vin ≥ 3.6V)。
  • 功耗与散热:功耗 Pd = (Vin - Vout) × Iout。在高输入电压且大电流工作时,器件功耗可能很大(例如 Vin=40V 时 Pd 可达数瓦),SOT-89-3 的散热能力受限,须通过限制输入电压、降低电流、增加串联预稳或改用大功率封装来控制结温,防止进入热关断。
  • 保护与滤波:若电源存在较大浪涌或瞬态,建议在输入端增加限流保护或滤波网络;输出端如驱动敏感负载,可加滤波以降低噪声或改善瞬态。

四、典型应用场景

  • 电池供电设备、低功耗物联网模块、便携式仪表;
  • 工业控制、传感器前端、模拟电路与参考电源;
  • 需要从较高电压轨降压至 3.0V 的点对点电源方案(在注意散热条件下)。

五、封装与布局建议

SOT-89-3 小型封装便于节省空间,但需注意铜箔散热:增大 GND 铜箔、并在 PCB 下方或周围布置散热铺铜、连接到多层地平面,可显著降低结温。优化走线以缩短输入/输出去耦回路,提高稳定性和抑制寄生振荡。

六、选型与实用提醒

H7530-H# 以其高输入耐压、低静态电流及良好 PSRR/噪声表现,适合对电源纯净度和待机功耗有要求的系统。但在高压大电流场合须慎重评估器件耗散与散热能力;若需要更大功率处理能力,可考虑并联预降压或选择更大封装型号。购买与技术支持请联系上海矽朋(Siproin)授权渠道或代理商。

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