WMSIC Electronic Components

Siproin SSP61CN2802MR

ModelSSP61CN2802MR
PackageSOT-23
BrandSIPROIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Siproin SSP61CN2802MR
Type
SIPROIN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SIPROIN
Electronic Component
SSP61CN2802MR
Electronic Component
1
Package
SOT-23
Electronic Component
Supervisorand positions IC
Electronic Component
0.12g
Electronic Component
1
Electronic Component
BM0264055029
Operating Temperature
30℃~+80℃
Operating Voltage
700mV~10V
ICType
Voltage Detector
Output Type
Electronic Component
Voltage
2.8V
Static Current(Iq)
1.1uA
Supervisor Voltage
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SSP61CN2802MR 产品概述

一、概述

SSP61CN2802MR 是上海矽朋(Siproin)推出的一款单路电压检测与复位芯片,采用 SOT-23 封装,面向低功耗嵌入式和电源管理应用。器件输出为开漏(open-drain),低电平有效复位信号,可在宽电压与温度范围内稳定工作,适合电池供电与微控制器上电/欠压保护场景。

二、主要参数

  • 监控阈值(标称):2.8V
  • 工作电压范围:0.70V ~ 10V
  • 复位有效电平:低电平有效(开漏输出)
  • 静态电流(Iq):典型 1.1 μA(低功耗设计)
  • 工作温度范围:-30℃ ~ +80℃
  • 监控通道数:1 路
  • 封装形式:SOT-23

三、功能特性

  • 单路电压监控:当被监控电压低于 2.8V 时,器件拉低复位引脚输出,提供明确的系统复位指示。
  • 开漏输出:兼容多电平系统,需外接上拉电阻,可与不同电压域的 MCU 或复位总线直接接口。
  • 宽工作电压:0.7V 起始工作电压使其可用于低电压系统(例如单节锂电池或特殊低压芯片)。
  • 极低静态电流:典型 1.1 μA,适合电池供电设备,减少待机能耗。
  • 工业级温度范围:满足大多数商用与部分工业场景的温度要求。

四、典型应用

  • MCU 上电复位与看门狗复位辅助
  • 电池供电设备的欠压保护(便携式设备、传感节点)
  • 多电源系统中作为上位电源/下位电源监控器
  • 电源管理与系统复位电路设计

五、引脚说明与使用建议

  • VDD:供电/被监控电压输入(器件可在 0.7V~10V 正常工作)
  • RESET(开漏):低电平有效,需通过外部上拉电阻连接到目标电平(典型上拉 10kΩ,可根据总线驱动和速度要求调整)。
  • GND:地。
    使用时注意:开漏输出不具备主动上拉能力;若需与内部看门狗或外部复位电路并联,应保证上拉电阻阻值与总线容量匹配以满足所需的上升时间与抖动抑制。

六、设计注意点

  • 在噪声环境下,为避免误触发,可在 VDD 输入端加入去耦电容(例如 0.1 μF)并靠近器件引脚布局。
  • 器件阈值为标称 2.8V,系统设计时应考虑实际容差与稳定性,必要时在 PCB 和电源设计上保证充分裕量。
  • 对温度敏感的应用请在 -30℃ 至 +80℃ 范围内验证功能可靠性。

七、封装与订购信息

  • 封装:SOT-23 小体积封装,便于表贴装配与批量生产。
  • 品牌:Siproin(上海矽朋)
    在选型与量产前建议索取完整规格书(Datasheet)和器件样片以完成可靠性与功能验证。若需进一步的参考电路或评估板建议,可联系供应商获取技术支持。

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