WMSIC Electronic Components

Siproin SSP9467

ModelSSP9467
PackageESOP8
BrandSIPROIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Siproin SSP9467
Type
SIPROIN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SIPROIN
Electronic Component
SSP9467
Electronic Component
1
Package
ESOP8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.328g
Electronic Component
1
Features
Built-in LDORegulator
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227783262
Operating Temperature
40℃~+85℃@(TJ)
Operating Voltage
6V~40V
Switching Frequency
500kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SSP9467 产品概述

SSP9467 是上海矽朋(Siproin)推出的一款降压型 DC‑DC 开关稳压器,采用 ESOP8 封装,面向汽车电子、工业控制、电源模块等需要宽输入电压、大电流输出的场景。器件内部集成高压开关管,工作频率固定在 500kHz,静态电流仅 110µA,支持 -40℃ 至 +85℃ 的结温范围(TJ),可在 6V40V 宽输入下输出 0.8V30V 可调电压,连续输出电流标称 3A(短时峰值可达 3.5A,视散热与布局而定),采用非同步整流拓扑(需要外接肖特基二极管)。

一、主要特性

  • 输入电压范围:6V ~ 40V
  • 可调输出电压:0.8V ~ 30V
  • 连续输出电流:3A,短时峰值可达 3.5A
  • 开关频率:500kHz(固定)
  • 静态电流(Iq):110µA(轻载待机低功耗)
  • 拓扑结构:降压式(内置开关管,非同步整流)
  • 通道数:单路输出
  • 工作温度:-40℃ ~ +85℃(TJ)
  • 封装:ESOP8

二、功能说明

SSP9467 采用降压(buck)架构,内部集成高压开关晶体管以简化外部元件,输出电压由外部电阻分压设定。由于采用非同步整流,设计时需配置合适的低压降肖特基二极管以降低整流损耗并保证高效率。器件具备低静态电流特性,适合需长时间待机或轻载节能场合。

三、典型应用

  • 工业控制与自动化电源
  • 汽车电子(车载供电模块,需注意符合汽车电磁兼容与热设计)
  • 通信设备与基站电源
  • 点亮 LED 驱动(需按电流和散热设计)
  • 车载/工控仪表、传感器供电

四、设计建议与外部元件选择

  • 电感:建议选用饱和电流高于 3.5A、DCR 低、频率适配 500kHz 的功率电感,典型值 2µH ~ 10µH,视输出电压与纹波要求调整。
  • 整流二极管:选择反向耐压 ≥ 输入最大电压、正向电流 ≥ 3A 的低压降肖特基二极管(SBD)。
  • 输入电容:低 ESR 的陶瓷或铝电解并联,额定电压建议 ≥ 63V,靠近 VIN/GND 放置。
  • 输出电容:优先多层陶瓷(低 ESR)以降低输出纹波,必要时并联固态/电解电容改善瞬态响应。
  • PCB 布局:VIN 至输入电容、开关管至二极管以及输出电感的走线应尽量短,布置成紧凑回路,注意热铜面积以利散热。

五、封装与热管理

ESOP8 封装便于焊接与散热。高功率工作时需在 PCB 下方或周围布置足够散热铜箔(热过孔或热垫),并考虑加装散热片或改善空气流动,保证器件在高载条件下稳定工作。

六、注意事项

  • 由于为非同步整流,效率在较高电流时受二极管损耗影响,若需更高效率建议评估同步整流方案替代。
  • 输入电压 40V 为器件极限参数,设计时应考虑瞬态浪涌和抑制措施(TVS、浪涌限流)。
  • 请严格按照典型应用电路和参考 PCB 布局进行设计,必要时进行热仿真与实际测量验证。

SSP9467 适合需要宽输入、可调输出且偏重稳定性与简单外部器件的降压电源设计场景。根据具体应用调整外部元件与散热方案,可在保证可靠性的前提下实现高密度电源解决方案。

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