WMSIC Electronic Components

SEMTECH SD15C.TCT SD15C

ModelSD15C.TCT
PackageSOD-323
BrandSEMTECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SEMTECH SD15C.TCT
Type
SEMTECH
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SEMTECH
Electronic Component
SD15C.TCT
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.031g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
75pF
Electronic Component
BM0228055711
Operating Temperature
55℃~+125℃
Voltage
29V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SD15C.TCT 产品概述

一、产品简介

SD15C.TCT 是 SEMTECH 推出的一款双向瞬态电压抑制二极管(TVS),采用紧凑型 SOD-323 封装,专为对抗静电放电(ESD)、感应浪涌(IEC 61000 系列)及雷击耦合脉冲而设计。器件工作状态下反向截止电压(Vrwm)为 15V,典型击穿电压为 16.7V,钳位电压约为 29V,单脉冲能力为 12A(8/20μs),峰值脉冲功率可达 350W,反向漏电流仅 1μA,结电容约 75pF,单路双向保护,工作结温范围 -55℃ 至 +125℃(Tj)。器件通过 IEC 61000-4-2、-4-4、-4-5 等抗扰标准验证,适用于多种工业与消费类应用。

二、主要性能与特点

  • 双向(Bi-directional)保护,适用于交流或双向数据线。
  • Vrwm = 15V,Vbr ≈ 16.7V,确保在正常总线电压下稳定工作。
  • 钳位电压 29V,可在瞬态事件时有效限制电压尖峰。
  • 峰值脉冲电流 Ipp = 12A(8/20μs),Ppp = 350W,抗浪涌能力强。
  • 低反向漏电 1μA,适合对静态功耗敏感的系统。
  • 结电容 75pF,对高速信号有一定影响,适合中低速接口保护。
  • 小尺寸 SOD-323,节省 PCB 面积,便于表面贴装自动化生产。

三、典型应用场景

  • 用户接口防护:USB、串口、按键、插拔接口等。
  • 电源线路与电池接口的瞬态保护(适用于±方向干扰)。
  • 工业控制、通信设备、POS 终端、测量仪器的浪涌与静电防护。
  • 对信号频率和带宽要求不极高的差分/单端信号线保护。

四、关键参数解读

  • Vrwm(反向截止电压)15V:器件在此电压以下不导通,适配 12–15V 等级电源保护。
  • Vbr(击穿)16.7V:进入导通保护区的触发点。
  • Vclamp(钳位)29V:在标准脉冲条件下限制的最大瞬态电压,决定被保护侧承受的峰值。
  • Ipp 与 Ppp 表征瞬态能量承受能力,12A@8/20μs 与 350W 表明器件能吸收较大脉冲能量而不损坏。
  • Cj = 75pF:对高速链路会引入负载和带宽下降,应在高频应用中权衡选择。

五、封装与 PCB 布局建议

  • 使用 SOD-323 表面贴装,建议将 TVS 靠近被保护的端口或连接器放置以最小化回路面积,缩短走线。
  • 保持接地短且粗,使用多孔地线或专用接地面以提升脉冲能量散逸能力。
  • 对高速或高带宽信号,若 75pF 结电容影响明显,考虑使用低电容替代型号或在保护器前加串联阻抗/滤波元件。

六、可靠性与使用注意

  • 器件工作温度范围 -55℃ 至 +125℃(Tj),需在额定温度下评估长期可靠性。
  • 符合 IEC 61000-4-2(ESD)、4-4(EFT)与 4-5(浪涌)测试等级,可作为系统防护元件之一,但系统级保护应结合滤波、限流与隔离设计。
  • 存储与装配时注意避免重复大电流脉冲击穿,焊接按 SOD-323 推荐工艺,避免过热导致器件性能退化。

七、选型建议

  • 若保护对象为高频或宽带信号,优先评估结电容对信号完整性的影响;对高速接口可考虑更低 Cj 的 TVS。
  • 需要双向保护且 Vrwm ≈15V 的应用,SD15C.TCT 提供平衡的能量承受与封装尺寸优势。
  • 系统级设计中应搭配合适的熔断、限流或滤波措施以提高整体抗扰能力与可靠性。

SD15C.TCT 以其高脉冲能量、高可靠性与小尺寸封装,适合中等电压等级接口的瞬态保护需求,是工业与消费类设备中常见的实用型 TVS 解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.