WMSIC Electronic Components

SEMTECH UCLAMP3301P.TCT UCLAMP3301P

ModelUCLAMP3301P.TCT
PackageSLP1006-2
BrandSEMTECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SEMTECH UCLAMP3301P.TCT
Type
SEMTECH
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SEMTECH
Electronic Component
UCLAMP3301P.TCT
Electronic Component
1
Package
SLP1006-2
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.031g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
30pF
Electronic Component
BM0227764841
Operating Temperature
40℃~+85℃
Voltage
8V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

UCLAMP3301P.TCT 产品概述

一、产品简介

UCLAMP3301P.TCT 是 SEMTECH 推出的单路单向瞬态电压抑制(TVS)二极管,专为 3.3V 工作电压系统提供快速、可靠的脉冲与静电放电保护。器件封装为 SLP1006-2,体积小、易于贴装,适合空间受限的消费类与工业级电子产品保护设计。

二、主要参数(概要)

  • 类型:TVS,单路、单向
  • 反向稳态电压 Vrwm:3.3V
  • 击穿电压 Vbr:约 3.5V
  • 钳位电压 Vc(典型):8V(@ 标准 8/20µs 测试条件)
  • 峰值脉冲功率 Ppp:40W @ 8/20µs
  • 峰值脉冲电流 Ipp:5A @ 8/20µs
  • 结电容 Cj:30pF
  • 反向泄漏电流 Ir:50nA(在 Vrwm 下)
  • 工作温度范围:-40°C ~ +85°C(Ta)
  • 符合防护等级:IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)

三、典型特性与优势

  • 针对 3.3V 供电和接口电路优化:Vrwm 与常用 3.3V 逻辑匹配,能在正常工作时保持极低泄漏,同时在异常过压瞬间快速钳位。
  • 中等钳位电压(8V):在 8/20µs 浪涌条件下可将被保护节点电压限制于可接受范围,降低后端器件受损风险。
  • 低漏电流(50nA):适合对待机功耗敏感的便携或 IoT 设备。
  • 小封装(SLP1006-2):利于紧凑布局与自动贴片生产,但热耗散受限,需注意 PCB 散热设计。
  • 符合常见电磁兼容标准:可作为对接插口、信号线和电源线的第一道防护。

四、典型应用场景

  • 3.3V 数字接口保护:UART、I2C、SPI、GPIO 等接口的过压与静电防护。
  • 通用电源轨保护:防止外部浪涌或接触放电对供电节点的冲击。
  • 消费类与工业电子:嵌入式设备、网关、传感器节点、通信模块等。
  • 非涉汽车安全关键系统(工作温度与封装适配时)。

五、设计与布局建议

  • 放置位置:尽量靠近被保护的输入/接头处,缩短导线长度以降低感抗与回路电感。
  • 接地处理:单向 TVS 的负极应直接接地面(稳定地),地线尽量采用短且宽的回流路径,如多层板落地平面或多颗过孔连接到强地平面。
  • 与高速信号的兼容性:30pF 结电容会对高速或差分信号产生影响,如 USB/高速串行,建议评估信号完整性或在 TVS 前加入小电阻/滤波器。
  • 热管理:SLP1006-2 封装热阻较大,若需频繁承受浪涌,建议在 PCB 增加铜箔面积或热沉路径以扩散热量。

六、选型与注意事项

  • 确保 Vrwm≥系统最大稳态电压且留有适当余量;对于 3.3V 系统,UCLAMP3301P.TCT 的 Vrwm 为 3.3V,需确认系统电压波动在可接受范围内。
  • 若应用对线缆注入的脉冲能量更高(例如更高的雷击或大电流浪涌),应选择更大功率等级或并联更高能量吸收元件。
  • 对于超高速接口或对串扰敏感的信号,评估 30pF 电容对上升/下降时间和阻抗匹配的影响,必要时考虑低容 TVS 或外加滤波元件。
  • 储存与焊接:遵循半导体封装的防潮与回流焊温度规范,避免超出厂商说明的焊接曲线。

总结:UCLAMP3301P.TCT 为 3.3V 系统提供了体积小、响应快、符合 IEC ESD/EFT 标准的可靠保护方案,适用于多数消费与工业电子应用。设计时应注意结电容与热耗散对系统信号完整性与长期可靠性的影响。若需更高能量或更低电容的替代,请根据实际应用条件进一步匹配产品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.