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SEMTECH SX1281IMLTRT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SEMTECH SX1281IMLTRT
- Type
- SEMTECH
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SEMTECH
- Electronic Component
- SX1281IMLTRT
- Electronic Component
- 1
- Package
- QFN-24-EP(4x4)
- Type
- Transceiver
- Electronic Component
- Wireless Transceiver IC
- Electronic Component
- 0.21g
- Electronic Component
- 132dBm
- Electronic Component
- 1
- Features
- RSSI
- Current
- 24mA
- Electronic Component
- BM0227299038
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.8V~3.7V
- Electronic Component
- LoRa
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SX1281IMLTRT 产品概述
SX1281IMLTRT 是 Semtech 面向 2.4GHz 频段的高性能收发器，专为 LoRa 无线链路和低功耗物联网应用设计。器件集合了 LoRa 调制的远距链路能力与灵活的数字接口，适用于对功耗、灵敏度和频谱效率有严格要求的嵌入式无线系统。
一、主要特点
- 工作频率范围：2.4GHz ~ 2.5GHz（典型应用频率 2.4GHz）
- 支持 LoRa 调制，兼顾 802.15.4 类应用场景
- 最高发射功率：12.5 dBm；发射电流约 24 mA（典型）
- 接收电流：8.2 mA（典型）
- 接收灵敏度可达 -132 dBm（LoRa 模式下）
- 数据速率最高可达 2 Mbps；支持低速远距模式与高速短距模式
- 电源电压范围：1.8 V ~ 3.7 V
- 接口类型：SPI（主控通信），同时提供 UART（调试/辅助）
- 器件类型：集成收发器（Tx/Rx）
二、技术规格（概览）
- 封装：QFN-24-EP（4 x 4 mm），带裸露焊盘便于散热和接地
- 工作温度范围：-40 ℃ ~ +85 ℃
- 品牌：Semtech（型号：SX1281IMLTRT）
- 典型功耗与性能指标：接收 8.2 mA、发射 24 mA、发射功率 12.5 dBm、灵敏度 -132 dBm
- 数据接口与控制：以 SPI 为主的控制接口，兼容多种 MCU 平台
三、典型应用
- LoRa 物联网节点与网关（2.4GHz 频段短/中距离应用）
- 智能表计、工业传感器网络、资产定位与跟踪
- 智能家居与楼宇自动化（需要低功耗与高灵敏度）
- 无线音视频控制、遥测与 OTA 固件更新（高数据率模式）
四、封装与布局建议
- QFN-24-EP 封装带裸露焊盘，建议将裸露焊盘与 PCB 地平面直接焊接以改善热性能与 RF 地屏蔽。
- RF 射频输出应配合推荐的天线匹配网络（阻抗 50 Ω），避免直接接天线导致驻波损耗。
- 电源引脚需在近旁布置去耦电容（例如 100 nF 与 1 μF 并联），并采用适当的电源滤波以降低发射期间的噪声影响。
- 保持射频走线短且连续，避开大面积数字回流线，以减小干扰与辐射耦合。
五、设计与合规注意事项
- 在系统设计时预留适当的功率裕量与散热路径，特别是在长时间高功率发射场景下。
- 天线选择与当地频谱管理法规相关，设计前确认 2.4GHz 使用规范与最大允许 EIRP。
- 模块化评估：在开发初期建议在评估板上验证灵敏度、发射功率与链路性能，再进行 PCB 集成优化。
六、总结
SX1281IMLTRT 为需要在 2.4GHz 频段实现 LoRa 技术的嵌入式应用提供了高灵敏度、低功耗和灵活接口的解决方案。其 QFN-24-EP 小型封装适合空间受限的终端设计，通过合理的 PCB 布局与天线匹配，可以在工业级温度范围内实现稳定可靠的无线通信性能。
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