WMSIC Electronic Components

SEMTECH GS2972-IBE3 GS2972

ModelGS2972-IBE3
PackageBGA-100
BrandSEMTECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SEMTECH GS2972-IBE3
Type
SEMTECH
Minimum package
168 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SEMTECH
Electronic Component
GS2972-IBE3
Electronic Component
1
Package
BGA-100
Type
Electronic Component
Electronic Component
Serializer / Deserializer
Electronic Component
0.35g
Electronic Component
1
Features
Built-in
Electronic Component
BM0257279212
Operating Temperature
20℃~+85℃
Operating Voltage
1.2V~3.3V;1.8V~3.3V
Data
2.97Gbps
Clock Frequency(fc)
27MHz;74.25MHz;148.5MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GS2972-IBE3 产品概述

GS2972-IBE3 是一款面向高速视频传输系统的串行器,采用 SEMTECH 品牌 BGA-100(11×11 mm)封装,专为将并行视频/图像数据转换为高比特率串行链路而设计。器件支持最高 2.97 Gbps 的串行数据速率,适配主流视频时钟(27 MHz、74.25 MHz、148.5 MHz),可在多种工作电压与工业级温度范围下可靠工作,是板级和模块级视频链路设计的稳健选择。

一、主要性能亮点

  • 支持串行数据速率:最高 2.97 Gbps,适用于 3G 级别的视频链路需求。
  • 时钟支持:27 MHz、74.25 MHz、148.5 MHz 等常见视频时钟输入,便于与不同分辨率/帧率的源设备配合。
  • 并行数据接口:每通道可配置为 20 位或 10 位并行宽度,满足不同像素/色深和通道数的系统需求。
  • 多电压兼容:器件支持灵活的电源组合(例如核心电源与 I/O 电压分离),工作电压范围覆盖 1.2 V ~ 3.3 V 及 1.8 V ~ 3.3 V,便于与各种逻辑电平系统集成。
  • 工作温度范围:-20 ℃ ~ +85 ℃,适用于常见商用与轻工业环境。

二、功能与应用场景

  • 视频前端与摄像头模块:在高分辨率摄像头或多通道图像采集板中,将并行视频像素流高效打包并通过高速差分串行链路输出。
  • 板间/模块间高速链路:适用于需要在 PCB 或光模块/同轴链路上传输大带宽视频数据的场景。
  • 广播与专业视频设备:用于需要稳定 3G 级别传输能力的广播、切换台或编码前端。
  • 医疗成像与工业视觉:在低延迟、高带宽的图像传输系统中提供可靠的串行化方案。

三、接口与时钟管理

  • 并行输入:支持 10-bit 与 20-bit 并行数据格式,可按系统需求选择通道位宽以平衡芯片资源与传输效率。
  • 时钟输入:器件支持多档视频主时钟(27/74.25/148.5 MHz),内部时钟倍频/锁相环(PLL)用于生成串行速率所需的高速时钟。
  • 差分串行输出:建议配合 100 Ω 差分阻抗的传输线布局,必要时采用 AC 耦合与适当的串行输出驱动终端匹配以保证信号完整性。

四、电源与热设计建议

  • 电源管理:建议将核心电源与 I/O 电源分离管理,按应用选定合适的稳压方案,避免上电顺序导致 PLL 或 IO 状态异常。
  • 典型电压组合:核心低压(例如 1.2 V)用于内部逻辑,I/O 侧支持 1.8 V~3.3 V 以兼容外部接口。
  • 布局与散热:BGA 封装需在 PCB 下方预留金属散热地/焊盘并注意多层接地,保证 2.97 Gbps 时的热耗散与信号回流路径。若长时间在高负载或无风环境下工作,建议增加散热片或改善空气流通。

五、信号完整性与 PCB 布局要点

  • 控制差分线阻抗(典型 90~100 Ω),保持差分对长度匹配,避免急剧转角。
  • 在串行输出处尽量缩短走线距离,并在串行链路入口处使用差分终端/共模滤波器降低反射与 EMI。
  • 为关键电源(PLL、模拟块)布置去耦电容并靠近芯片引脚,减小电源噪声对锁相性能的影响。
  • 对并行输入信号实施适当的阻抗匹配或源端终端,尤其在高速并行模式(20-bit)下对信号完整性要求更高。

六、封装与可靠性

  • 封装形式:BGA-100,封装尺寸 11×11 mm,适合高密度 PCB 布局与自动化贴装工艺。
  • 环境可靠性:-20 ℃ ~ +85 ℃ 的工作温度覆盖大多数商用与轻工业应用;建议在严苛环境(更宽温度/振动/湿度)下做额外验证与加固设计。

七、选型与工程注意事项

  • 确认接口电压匹配:在选型与系统集成阶段,务必核对外部并行源与接收端的电平(1.8V/2.5V/3.3V)以配置合适的 I/O 电压。
  • 针对链路长度与介质(同轴、光纤或 PCB 背板)评估是否需要中间驱动/收发器或均衡器。
  • 参考厂商数据手册完成上电顺序、去耦布局及敏感信号隔离设计,必要时与厂商应用工程师沟通以优化方案。

结语:GS2972-IBE3 以其高达 2.97 Gbps 的串行能力、多种并行位宽支持与灵活电源配置,适合需要高带宽、低延迟的视频传输设计。通过遵循电源、布局与信号完整性方面的工程建议,可在板级与模块级系统中实现可靠且稳定的高速视频链路。若需进阶设计支持或详细引脚、电气规格,请参阅 SEMTECH 官方数据手册或联系技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.