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SUPSiC GAQY252G3EH
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GAQY252G3EH
- Type
- SUPSIC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GAQY252G3EH
- Electronic Component
- 1
- Package
- SMD-4
- Electronic Component
- Solid State Relay (MOS Output)
- Electronic Component
- 0.572g
- Electronic Component
- 1
- Electronic Component
- BM0229953534
- Resistor
- 50mΩ
- Electronic Component
- 2A
- Load Voltage
- 60V
- Type
- AC,DC
- (Vf)
- 1.2V
- Current(If)
- 50mA
- (Ton)
- 1.5ms
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQY252G3EH 产品概述
一、产品简介
GAQY252G3EH 是 SUPSiC（国晶微半导体）推出的一款小封装固态继电器类器件，触点形式为 1A（单刀单掷，常开），采用 SMD-4 表面贴装封装。器件支持 AC 与 DC 输入驱动，面向需要无机械接点、高可靠性、免维护的低压开关场合。
二、主要电气参数
- 连续负载电流：3A（额定连续导通电流）
- 负载电压：60V（最大承受负载端电压）
- 导通电阻：50mΩ（典型导通态 RON）——在 3A 时最大导通损耗约为 I^2·R ≈ 0.45W
- 正向压降 Vf：1.2V（参考值，配合输入电流 If 测量）
- 正向电流 If：50mA（输入端工作电流参考）
- 导通时间 Ton：1.5ms；截止时间 Toff：50μs（注意开关上升与下降的时间特性）
三、结构与封装
SMD-4 小型贴片封装利于高密度 PCB 设计与自动化贴片生产。封装尺寸和引脚形式适配常见回流焊工艺，便于在工业控制、家用电器和消费电子中进行模块化布局。
四、主要特点与应用优势
- 无机械磨损、抗振动能力强，适合长寿命与高可靠性要求场合；
- 低导通电阻带来较低导通损耗（在额定电流下约 0.45W），降低发热与散热需求；
- 输入支持 AC / DC，驱动灵活，可直接与多种控制信号配合；
- SMD-4 封装节省空间，便于批量贴装与成本控制。
五、典型应用场景
适用于小功率开关电源、直流/交流负载切换、继电保护辅助回路、工业控制板、通讯设备电源控制及需要长寿命无触点切换的场合。由于 Ton 相对较长，建议用于低频或瞬时开关场合，不推荐用于高频 PWM 开关。
六、使用建议与注意事项
- 输入侧按 Vf 与 If 选取限流或驱动电路，推荐保证稳定的 50mA 输入电流以获得标称响应；
- 输出侧尽量考虑散热与 PCB 铜箔面积，按 I^2·R 估算功耗并留足安全裕量；
- 对于开关速度敏感的系统，应评估 1.5ms 的导通延时对整体响应的影响；
- 存储与回流焊工艺请参考厂方推荐的温度曲线与封装可靠性说明，避免超温损伤器件。
如需器件数据手册、封装尺寸图或样片测试报告，可联系 SUPSiC（国晶微半导体）授权代理或销售工程师获取更详细资料。
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