Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SUPSiC GAQY412EH
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GAQY412EH
- Type
- SUPSIC
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GAQY412EH
- Electronic Component
- 1
- Package
- SMD-4P
- Electronic Component
- Solid State Relay (MOS Output)
- Electronic Component
- 0.577g
- Electronic Component
- 1
- Electronic Component
- BM0258761858
- Resistor
- 1Ω
- Operating Temperature
- 40℃~+85℃
- Resistor
- 10000MΩ
- Electronic Component
- 1B
- Load Voltage
- 60V
- Type
- AC,DC
- (Pd)
- 350mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQY412EH 产品概述
一、产品简介
GAQY412EH 是国晶微半导体（SUPSiC）推出的一款小型光电固态继电器（PhotoMOS 类），封装为 SMD-4P，触点形式为 1B（单刀单掷 - 常闭）。器件集成光耦合输入与 MOSFET 输出，适合对体积、可靠性与隔离性能有要求的低功率开关场合。
二、主要规格
- 连续负载电流：500 mA
- 负载电压：60 V
- 导通电阻（RON）：1 Ω
- 正向压降（Vf）：1.2 V；正向电流（If）：7 mA（典型驱动）
- 导通时间（Ton）：500 μs；截止时间（Toff）：250 μs
- 隔离电压（Vrms）：5 kV；绝缘电阻：10000 MΩ
- 总功耗（Pd）：350 mW
- 输入类型：AC / DC 兼容
- 工作温度范围：-40 ℃ ～ +85 ℃
- 封装：SMD-4P（表面贴装，四引脚）
三、性能要点
- 低导通电阻（1 Ω）与 500 mA 连续电流，适合开关小功率直流或低频交流负载。
- 输入驱动电流低（If 7 mA），便于 MCU、逻辑门或外围驱动器直接驱动。
- Ton/Toff 在数百微秒级，适合多数信号切换与断续控制场景，但非高速脉冲应用。
- 高隔离电压（5 kV）与高绝缘电阻（10000 MΩ）保证信号与电源之间良好安全隔离，适用于需要隔离防护的工业与通信设备。
- 宽温区（-40～+85 ℃）满足工业级环境要求。
四、典型应用
- 工业控制与通信接口隔离
- 电源管理与电池保护的小功率开关
- 仪器仪表与测量设备的信号隔离
- 安防、家电等对寿命与可靠性有要求的场合
- 需 AC / DC 双向输入兼容的场景
五、设计与使用建议
- 输入侧建议串联限流电阻以控制 If，不超过典型 7 mA，满足 AC 驱动时应考虑双向或整流方案。
- 受限于总功耗 Pd=350 mW 与 RON=1 Ω，建议在高温或连续最大电流条件下进行热流量评估并适度降额使用；必要时在 PCB 增加散热铜箔。
- 保持 PCB 上相应的爬电与间隙距离以配合 5 kV 隔离等级要求，并按生产商推荐的焊盘尺寸和回流工艺组装。
- 如需更快切换或更高电流/电压，请参考同系列或其他型号产品。
六、封装与可靠性
SMD-4P 表面贴装封装利于自动贴装与回流焊接，适配紧凑 PCB 布局。器件在额定环境下具备良好绝缘与长期可靠性，详细的陆脚尺寸、焊接工艺和可靠性测试请参阅国晶微半导体官方数据手册与质量规范。
如需样品、数据手册或参考电路，请联系 SUPSiC（国晶微半导体）或其授权分销商获取最新资料与应用支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
