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SUPSiC GAQV252G2EH
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GAQV252G2EH
- Type
- SUPSIC
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GAQV252G2EH
- Electronic Component
- 1
- Package
- SMD-6P
- Electronic Component
- Solid State Relay (MOS Output)
- Electronic Component
- 1.12g
- Electronic Component
- 1
- Electronic Component
- BM0258761864
- Resistor
- 100mΩ
- Electronic Component
- 2A
- Load Voltage
- 60V
- Type
- AC,DC
- (Vf)
- 1.2V
- Current(If)
- 50mA
- (Ton)
- 2ms
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQV252G2EH 产品概述
GAQV252G2EH 为 SUPSiC（国晶微半导体）推出的 SMD-6P 小型开关器件，适用于对体积、可靠性与开关特性有要求的电子系统。该器件结合低导通电阻与可接受的驱动电流，能够在工业控制、通信接口、消费电子等场景中替代传统机械继电器或用作隔离开关单元。
一、主要性能
- 触点形式：1A（单刀单掷，常开）
- 连续负载电流：2.5 A
- 负载电压：60 V
- 正向压降（Vf）：1.2 V（At If = 50 mA）
- 正向电流（If）：50 mA（典型驱动值）
- 导通电阻：100 mΩ（导通状态下）
- 导通时间（Ton）：2 ms
- 截止时间（Toff）：100 μs
- 输入类型：AC / DC
- 封装：SMD-6P
二、特点与优势
- 低导通电阻（约100 mΩ），在最大连续电流下仍能维持较低功耗，适合对热量敏感的应用。
- 输入支持 AC 与 DC，驱动灵活，可直接与多种控制信号兼容。
- SMD-6P 表面贴装封装，适合自动化贴装与高密度 PCB 布局。
- 导通/截止时间特性表明关闭响应快（100 μs），开启相对平缓（2 ms），便于抑制开关冲击并减少电磁干扰（需按应用评估）。
三、典型应用
- 通信、网络设备中的信号切换与线路保护
- 电源管理与电池系统的低压开关与保护回路
- 工业控制与仪器仪表中的隔离开关单元
- 小功率直流负载控制、开关矩阵、测试自动化系统
四、设计与使用注意事项
- 热耗估算：在最大连续电流 2.5 A 与 RON 100 mΩ 条件下，开关端热耗约 P = I^2·R ≈ 0.625 W，需在 PCB 布局中预留散热路径与散热铜箔以避免过热。
- 驱动考虑：典型驱动电流 If = 50 mA，驱动电路须能稳定提供该电流（AC 驱动时考虑整流或限流元件）。
- 开关频率限制：由于 Ton = 2 ms，器件更适合低频切换或静态开/关，非高频 PWM 驱动元件。
- 感性负载保护：开关感性负载时建议使用吸收电路或 RC 抗干扰网络，保护器件并降低干扰。
- PCB 布局：SMD-6P 封装便于贴装，但需按厂商推荐封装与焊盘尺寸进行布局，保证焊点可靠性与热扩散。
五、封装与可靠性
SMD-6P 封装支持自动化生产与可靠的机械强度，适合量产。建议在最终设计前参照 SUPSiC 的完整数据手册与测试曲线，确认隔离特性、绝缘等级及环境温度范围，以满足特定应用的长期可靠性要求。
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