Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SUPSiC GAQV216EH
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GAQV216EH
- Type
- SUPSIC
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GAQV216EH
- Electronic Component
- 1
- Package
- SMD-6P
- Electronic Component
- Solid State Relay (MOS Output)
- Electronic Component
- 1.054g
- Electronic Component
- 1
- Electronic Component
- BM0258761857
- Resistor
- 35Ω
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- 2A
- Load Voltage
- 600V
- Type
- AC,DC
- (Pd)
- 500mW
- (Vf)
- 1.2V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQV216EH 产品概述
一、产品简介
GAQV216EH 是 SUPSiC（国晶微半导体）推出的一款光隔离式固态开关器件，采用 SMD-6P 封装，提供高压绝缘及小电流开关能力。器件为单刀单掷常开（1A）触点形式，适合在需要电气隔离且切换小功率负载的场合替代机械继电器，具备长寿命、无触点电弧和抗震动优势。
二、主要电气参数
- 连续负载电流：80 mA
- 额定负载电压：600 V
- 导通电阻：35 Ω（典型）
- 输入正向压降 Vf：1.2 V，正向电流 If：7 mA（驱动兼容 AC / DC）
- 隔离电压 Vrms：5 kV
- 导通时间 Ton：500 μs，截止时间 Toff：20 μs
- 总功耗 Pd：500 mW
- 工作温度范围：-40 ℃ ~ +85 ℃
三、封装与热管理
SMD-6P 小型贴片封装，适合自动贴装与回流焊流程。由于器件Pd为500 mW 且导通电阻存在热耗散，PCB 设计时应在焊盘下方和周边预留散热铺铜并保证合适的过孔散热路径。同时注意满足封装对应的爬电与间隙距离，配合器件 5 kV 隔离能力实现可靠绝缘。
四、典型应用场景
- 工业控制与信号隔离：在传感器、PLC 扩展模块中进行低电流开关与信号隔离。
- 医疗与测试仪器：对信号链路做高压隔离，避免地环路干扰。
- 通信与计量设备：遥测、数据采集前端的小电流开关控制。
- 家用与便携电子：替代小型继电器实现长寿命开关功能。
五、使用注意事项
- 额定 80 mA 为连续负载上限，建议留有裕量并考虑工作温升与热阻。
- 对感性负载或有浪涌电流的场合需加限流或吸收电路，防止超额冲击。
- 输入端支持 AC、DC 驱动，但应保证驱动电流稳定并考虑驱通时间要求（Ton/Toff）。
- 布局时保证输入与输出之间的爬电距离与绝缘材料符合系统安全规范。
六、总结
GAQV216EH 以其 600 V 耐压、5 kV 隔离和小型 SMD-6P 封装，提供稳定的低电流固态开关解决方案。适用于对寿命、抗振动和电气隔离有较高要求的应用，通过合理的热设计与外围防护，可在多类电子系统中替代传统机械继电器，提升可靠性与响应一致性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
