WMSIC Electronic Components

SIT SIT1050TK

ModelSIT1050TK
PackageTDFN-8-EP(3x3)
BrandSIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SIT SIT1050TK
Type
SIT
Minimum package
5000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SIT
Electronic Component
SIT1050TK
Electronic Component
1
Package
TDFN-8-EP(3x3)
Type
CAN Transceiver
Electronic Component
CAN Transceiver
Electronic Component
0.058g
Electronic Component
1
Channel Count
1
Features
TXD
Electronic Component
BM0227604228
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~5.5V
Operating Current
70mA
Data
1Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SIT1050TK 产品概述

一、产品简介

SIT1050TK(品牌:SIT 芯力特)是一款面向工业与车规级网络的高速 CAN 收发器,支持最高 1 Mbps 数据速率,工作电压范围为 4.5V 至 5.5V,工作温度覆盖 -40℃ 至 +125℃。器件采用 TDFN-8-EP(3×3 mm)小型裸露散热焊盘封装,适合空间受限且需良好散热的应用场景。

二、主要参数

  • 类型:CAN 收发器
  • 工作电压:4.5V ~ 5.5V
  • 数据速率:最高 1 Mbps
  • 工作电流(典型):70 mA
  • 静态电流(待机/空闲态):10 mA
  • 工作温度:-40℃ ~ +125℃
  • 封装:TDFN-8-EP(3×3 mm,带裸露焊盘)

三、主要特性与优势

  • 兼容 1 Mbps 的高速 CAN 网络,满足常见 CAN/CAN FD(单速)通信需求;
  • 宽温域设计,适合严苛工业及车载环境;
  • 紧凑封装同时带裸露散热焊盘,有利于热管理与高密度 PCB 布局;
  • 低静态电流特性可降低待机功耗,70 mA 的工作电流在驱动总线时保持稳定通信;
  • 标准接口,便于与主控 MCU、网关或收发模块无缝集成。

四、典型应用场景

  • 车载通信模块、车身控制单元(BCM)与网关;
  • 工业现场总线、PLC 与运动控制系统;
  • 楼宇自动化、安防系统、数据采集节点;
  • 电机驱动与传感器网络中需要可靠差分通信的场合。

五、封装与 PCB 设计建议

  • 推荐在 VCC 端并联 0.1 µF 陶瓷去耦电容,靠近器件引脚布局;
  • 将差分 CAN_H/CAN_L 走线成对且长度匹配,保持差分阻抗(通常 120 Ω);
  • 在总线两端各放置 120 Ω 终端电阻,靠近收发器端布局;
  • 使用裸露焊盘(EP)与多层接地平面良好焊接以提升散热性能;
  • 在总线入口处建议配置瞬态抑制二极管(TVS)以增强抗浪涌/ESD 能力。

六、可靠性与采购建议

SIT1050TK 针对宽温、工业与车载使用场景进行了设计,建议在批量采购前进行样片评估,包括热性能、EMC 兼容性及长期老化测试。封装小型化有利于系统集成,但对 PCB 焊接和回流曲线有一定要求,请与生产线热工艺调整匹配。购买时确认供货批次与技术支持以确保稳定供应与后续替代件规划。

如需样套电路、封装尺寸图或评估板参考,请告知,我可提供更详细的硬件接入与调试建议。

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