WMSIC Electronic Components

SILAN SVF18N50PN

ModelSVF18N50PN
PackageTO-3P
BrandSILAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SILAN SVF18N50PN
Type
SILAN
Minimum package
30

Technical parameters

Electronic Component
SILAN
Electronic Component
SVF18N50PN
Electronic Component
1
Package
TO-3P
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
7.223g
Electronic Component
1
Electronic Component
BM0231143402
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
240W
Electronic Component
30
Voltage(Vdss)
500V
Capacitor(Ciss)
2.32nF
Output Capacitor(Coss)
282pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SVF18N50PN 产品概述

SVF18N50PN 是士兰微(SILAN)推出的一款高压 N 沟道功率场效应管(MOSFET),专为中高压开关电源与功率转换应用设计。器件耐压 500V、连续漏极电流可达 18A,结合 TO-3P 大功率封装与较低导通电阻,使其在离线开关电源、功率因数校正(PFC)、逆变与工业驱动等场合表现优异。

一、主要参数一览

  • 类型:N 沟道 MOSFET
  • 漏源电压 Vdss:500V
  • 连续漏极电流 Id:18A
  • 导通电阻 RDS(on):260 mΩ @ Vgs = 10V
  • 阈值电压 Vgs(th):4V @ Id = 250 μA
  • 总栅极电荷 Qg:38 nC @ Vgs = 10V
  • 输入电容 Ciss:2.32 nF
  • 输出电容 Coss:282 pF
  • 反向传输电容 Crss(Miller):7 pF
  • 耗散功率 Pd:240W(与散热条件相关)
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:TO-3P

二、产品特点与优势

  • 高耐压:500V 额定耐压适用于离线电源桥臂、PFC 级和高压逆变器。
  • 中高电流能力:18A 连续电流满足多数中小功率转换器与驱动器需求。
  • 大功率耗散:TO-3P 封装配合良好散热措施,可实现高达 240W 的功率耗散(依散热条件)。
  • 较小栅—漏电容(Crss = 7 pF):利于抑制 Miller 效应,有利于提升开关速度与降低误触发风险。
  • 合理的栅极电荷(Qg = 38 nC):在保证开关性能的同时,对驱动器选型提出了中等驱动能力要求。

三、电气性能与驱动建议

  • 为得到标称 RDS(on)(260 mΩ),建议栅极驱动电压采用 10V(亦可采用 12V 以留有裕量);阈值电压较高(4V @ 250μA),因此不足以使用弱驱动。
  • 由于总栅极电荷较大,驱动器需提供足够瞬态电流以实现快速开关,推荐在栅极串联阻值进行优化(常见 5Ω ~ 20Ω)以兼顾开关速度与振铃抑制。
  • 高压应用中建议配合合适的吸收网络(RC、RCD)或 TVS 二极管,防止开关瞬态超过器件耐压。
  • 开关频率与开关损耗需权衡:Ciss 与 Coss 决定了切换损耗随频率上升的增长,适合中低至中频率(例如几十 kHz 范围)开关设计。

四、热设计与封装说明

  • TO-3P 金属/塑封复合结构提供较大散热面,要求使用良好接触的散热器与导热介质(导热硅脂或绝缘垫片)以降低结壳温差。
  • Pd 标称值 240W 为理想散热条件下获得,实际系统中需根据结到环境热阻、散热器面积与气流情况重新计算结温。
  • 建议在布局时保证引脚与散热片的电气隔离与绝缘要求,并注意螺丝紧固力矩与绝缘片的厚度对热阻的影响。

五、典型应用场景

  • 离线开关电源(半桥、功率开关)
  • 功率因数校正(PFC)前端开关
  • 中小功率逆变器与UPS
  • 工业电源与电机控制中的开关元件
  • 大型 LED 驱动电路、高压电源模块

六、使用注意与采购信息

  • MOSFET 对静电敏感,PCB 装配与测试时应采取 ESD 保护措施。
  • 设备封装与散热设计直接影响可靠性,建议进行实际结温测试以验证长期运行条件。
  • 订购信息:品牌 SILAN(士兰微),封装 TO-3P,常见型号 SVF18N50PN,单片采购或批量询价请联系供应商提供库存与出货周期。

如需基于该器件的典型开关电源原理图、驱动电路建议或热仿真参数,我可以根据具体应用场景(例如开关频率、功率等级与散热条件)提供更详细的设计建议。

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