WMSIC Electronic Components

STE R11F1E103MQ0T0S0N0

ModelR11F1E103MQ0T0S0N0
PackageP=7.5mm
BrandSTE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
STE R11F1E103MQ0T0S0N0
Type
STE
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
STE
Electronic Component
R11F1E103MQ0T0S0N0
Electronic Component
1
Electronic Component
10nF
Package
P=7.5mm
Electronic Component
Through-hole Capacitor
Electronic Component
±20%
Electronic Component
1.162g
Pitch
7.5mm
Electronic Component
1
Electronic Component
BM0259565673
Electronic Component
Y5V
Voltage
2kV
Capacitor
3mm
Capacitor
11mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

R11F1E103MQ0T0S0N0 产品概述

一、概述

R11F1E103MQ0T0S0N0 为 STE(松田)品牌的直插瓷片电容器,额定电压 2kV,容值 10nF(标称),精度 ±20%,温度特性 Y5V。该器件为径向引线、插件封装,中心引脚间距 P = 7.5mm,电容体直径约 11mm,厚度约 3mm,适用于需要高耐压且体积相对紧凑的通用高压电路。

二、主要参数

  • 容值:10nF(103)
  • 精度:±20%
  • 额定电压:2000 V(DC)
  • 温度系数:Y5V(温度稳定性较弱,适合对容量漂移要求不高的场合)
  • 引脚形式:径向引线,插件(P = 7.5mm)
  • 电容体尺寸:直径 ≈ 11mm,厚度 ≈ 3mm
  • 封装类型:直插瓷片(直插/插件)

三、产品特点

  • 高耐压:2kV 额定电压,适合中高压工作场合。
  • 简洁的插件形式:径向引线便于手工或波峰焊装配,适用于原型和小批量生产。
  • 机械强度较好:瓷片结构在抗冲击和耐久性方面优于薄膜类高压元件(在正常安装与使用条件下)。
  • 成本与体积优势:在同等耐压和容值范围内,直插瓷片常具有较好的性价比。
  • 温度特性限制:Y5V 介质在温度与偏压作用下容量变化较大,不适用于对温度稳定性、容量精度要求高的精密应用。

四、典型应用

  • 高压耦合与隔直(DC耦合/隔直)电路
  • 高频脉冲或测量电路中的耦合/旁路(需结合脉冲特性确认)
  • 高压电源的滤波、旁路或分压器(非精密分压)
  • 真空管、放电、示波器探头等需要高绝缘电压的老电路改造或维修项目

五、封装与安装建议

  • 插件封装(P = 7.5mm)适合常规通孔 PCB 布局,请在 PCB 上留有足够的爬电与气隙距离以满足高压安全要求。
  • 引线弯折时应尽量远离电容体本体进行,避免对陶瓷芯体施加应力导致裂纹。
  • 焊接时遵循通用插件元件工艺,避免长时间高温直接加热电容体;如需波峰或回流操作,应参考厂家焊接曲线以防热应力造成损伤。
  • 在高湿环境或需要额外绝缘时,可考虑聚合物涂覆或套管处理以提高爬电耐受性。

六、使用与保存注意事项

  • Y5V 介质对温度与偏压敏感,工作温度和直流偏压会引起显著容量变化,应在设计时留有余量。
  • 避免机械冲击与过度弯折引发裂纹;出现可见裂纹时应停止使用。
  • 存放时应避免潮湿、强酸强碱环境及剧烈温度变化,建议按常规电子元器件库房管理(干燥、防尘)。
  • 在高压应用中,务必做耐压和绝缘测试(依据系统安全要求),并考虑适当的电压裕量和防护措施。

七、技术支持与采购建议

若需更多详细电气参数(如绝缘电阻、耐压测试条件、脉冲耐受能力等)或焊接/可靠性数据,请向 STE(松田)或授权分销商索取完整数据手册与样品测试报告。下单时确认产品型号完整性(R11F1E103MQ0T0S0N0)与所需批次、合规证明(如 RoHS)以保证一致性与可追溯性。

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