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S14F1D103MN0B0S0N0是STE松田电子推出的一款高压径向直插瓷片电容,专为中高压电子电路设计,兼顾成本控制与基础性能需求。其核心参数与型号编码对应明确:
该电容采用Y5V温度系数,属于高介电常数(K>1000)瓷介材料,虽容值随温度变化有一定漂移(典型范围:-30℃至+85℃内,容值变化±20%),但成本优势显著,适合对容值精度要求不苛刻的高压场景。其介电损耗(tanδ)≤0.02(1kHz下),满足基础滤波需求。
额定电压为3kV直流,实际应用于交流电路时需降额(交流额定值约为直流的1/√2≈2.12kV),避免过压击穿。绝缘电阻≥10^9Ω(25℃、100V DC测试条件),可有效抑制漏电流,保障电路安全性。
±20%的精度覆盖了多数工业级电路需求,例如电源滤波、高压耦合等场景无需极高容值精度,该参数可实现功能且降低整机成本。
采用径向直插封装,安装脚距(P)为10mm,适配标准PCB焊盘设计(焊盘中心距需匹配10mm);电容体物理尺寸为直径13mm×厚度3.5mm,体积紧凑,可在高密度PCB布局中灵活放置;引线直径符合常规插件焊接要求(0.6-0.8mm),支持手工或自动焊接工艺。
该电容因高压耐受与成本平衡的特性,广泛应用于以下领域:
STE松田是国内专注于瓷片电容研发生产的企业,产品符合IEC 60384-14(固定瓷介电容器国际标准)及国内GB/T 14472-2017要求,生产过程通过ISO 9001认证,批量产品一致性良好。该型号电容经高低温循环(-40℃至+85℃,500次)、耐电压(3.3kV DC,1s)、振动(10-2000Hz,1g) 等可靠性测试,可满足工业级环境下的长期稳定运行。
该产品以高性价比、高压耐受为核心优势,是工业级中高压电路的实用选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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