WMSIC Electronic Components

GL480E00000F

ModelGL480E00000F
PackageDIP
BrandSHARP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SHARP GL480E00000F
Type
DIP
Unit
Electronic Component
Minimum package
2000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SHARP
Electronic Component
GL480E00000F
Electronic Component
1
Package
DIP
Electronic Component
950nm
Electronic Component
Infrared Emitter
Electronic Component
13°
Electronic Component
1g
Electronic Component
45nm
Electronic Component
1
Electronic Component
BM0231095896
Operating Temperature
25℃~+85℃
Current
50mA
(Vf)
1.2V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GL480E00000F 产品概述

GL480E00000F 为 SHARP(夏普)出品的一款 950nm 红外发射二极管(IR Emitter),采用传统 DIP 封装,适用于各类红外发射与检测系统。该器件以窄视角、高效率和适中的电气参数著称,适合用于检测、测距、遥控和通信等多种场景。以下内容对该器件的主要特性、典型应用、参数限制及使用建议做出说明,便于工程选型与电路设计。

一、主要参数一览

  • 品牌:SHARP(夏普)
  • 型号:GL480E00000F
  • 发射波长:典型 950 nm(红外)
  • 正向压降 Vf:1.2 V(典型)
  • 额定正向电流 IF:50 mA(最大/建议值请参见原厂数据手册)
  • 最大耗散功率 Pd:75 mW
  • 反向耐压 Vr:6 V(最大)
  • 视角(半功率角):13°(窄光束,方向性好)
  • 光谱半波宽(FWHM):45 nm
  • 工作温度范围:-25 ℃ ~ +85 ℃
  • 封装形式:DIP(便于穿孔插装或夹持)

二、性能特征与优势

  • 窄视角(13°):输出光束集中,适合需要定向照射或远距离传输的应用,能提高接收端的信噪比。
  • 工作波长 950 nm:在常见硅光电探测器灵敏范围内,兼容大多数红外接收器和光传感器。
  • 中等正向压降与电流等级:Vf ≈ 1.2 V,标称 IF 可达 50 mA,便于与常见驱动电路配合。
  • 封装稳定可靠:DIP 封装便于手工焊接、波峰/回流焊(注意温度限制)以及通过插座更换,适合原型和量产。

三、典型应用场景

  • 红外遥控发射端(需按法规与接收灵敏度配合)
  • 非接触式测距、障碍物检测(与匹配受光器组成发射/接收对)
  • 近红外通信(短距离数据链路)
  • 工业自动化中的物体检测与计数系统
  • 医疗或生物光学设备中作为近红外光源(需评估生物相容性与安全性)

四、电气与热设计注意事项

  • 额定耗散功率 Pd = 75 mW:指器件允许的最大结封装耗散。连续在 IF = 50 mA 下工作时应检查结温上升,必要时降低占空比或添加散热措施。推荐查阅完整数据表以获得正向电流与结温之间的曲线。
  • 反向电压 Vr = 6 V:反向偏置时禁止超过此值,以免损坏 PN 结。
  • 驱动电阻计算示例(仅为参考):当使用 5 V 电源,目标 IF = 50 mA,R = (5V - Vf) / IF ≈ (5 - 1.2) / 0.05 = 76 Ω → 常用 75 Ω 或 82 Ω 且需考虑精度与功耗。电阻耗散功率约 0.19 W,建议选择 1/2 W 或更高功率等级。
  • 热管理:在高占空比或高环境温度下,应降低平均电流或增加冷却,以防结温超限导致寿命下降或参数漂移。
  • 针对脉冲驱动:若用于脉冲驱动,允许的峰值电流可能高于 50 mA,但需参照原厂脉冲规格(占空比、脉宽限制)以免损坏器件。

五、封装与机械特征

  • DIP 封装便于穿孔插装,具有机械稳定性好、焊接方便等优点。
  • 引脚间距、引脚长度与外形尺寸请以原厂机械图为准,设计 PCB 布局时留足焊盘与绝缘间距。
  • 高温焊接注意:若采用回流或波峰焊,需遵循供应商的封装耐温限制,避免封装或内部结构受热损伤。

六、可靠性与使用建议

  • 在长期连续运行场景中,建议采用低于最大额定电流的工作点,以延长寿命并保持光强稳定。
  • 储存与使用环境应避免潮湿、强腐蚀性气体及超出温度范围的环境。
  • 设计接收端时需根据视角和光束特性选择合适的透镜或光学配件,以优化系统灵敏度与抗干扰能力。
  • 关键应用(如医疗、汽车等)建议进行整机级电气与光学验证与认证测试。

总结:GL480E00000F 是一款面向定向发射应用的 950 nm 红外 LED,凭借窄视角与标准 DIP 封装适用于多种穿孔安装与原型设计场景。具体电气极限、光学输出与脉冲能力建议参照夏普原厂完整数据手册,并在系统设计阶段做热、光、电一体化验证以确保长期稳定运行。若需进一步的典型应用电路、机械图或光学分布图,请提供具体使用条件或查询原厂技术文件。

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