WMSIC Electronic Components

TI SN74LVC1G14DBVR

ModelSN74LVC1G14DBVR
PackageSOT-23-5
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) SN74LVC1G14DBVR
Type
TI
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74LVC1G14DBVR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Inverter
Electronic Component
74LVC
Electronic Component
0.033g
Electronic Component
1
Electronic Component
1
Channel Count
1
Features
Power Supply
Electronic Component
BM0093065362
Operating Temperature
40℃~+85℃
Operating Voltage
1.65V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74LVC1G14DBVR 产品概述

1. 产品背景

SN74LVC1G14DBVR 是德州仪器(Texas Instruments, TI)推出的一款高性能施密特触发反相器,其在现代电子设计中占据重要地位。该器件采用了小型的 SOT-23-5 表面贴装封装,特别适合需要高集成度和空间节省的应用。

2. 主要特点

  • 逻辑类型:SN74LVC1G14 是一个单通道施密特触发反相器,它使用施密特触发器电路,能够有效消除输入信号的小幅抖动,保证了输出信号的稳定性和可靠性。
  • 电源电压范围:该器件的供电电压范围宽广,从 1.65V 到 5.5V,这使得其适用于多种电源电压环境,能够在不同的逻辑电平下工作。
  • 高、低逻辑电平输入:器件设置了明确的高、低逻辑输入电平范围,逻辑高电平可在 1.16V 至 3.33V 之间波动,逻辑低电平范围则为 0.39V 至 1.87V,频宽能够严格符合多种应用需求。
  • 传播延迟:SN74LVC1G14 在 5V 电压和 50pF 负载的条件下,最大传播延迟仅为 5ns,表现出迅速的信号响应,极大提升了系统的工作效率。
  • 静态电流:其静态电流最高仅为 10µA,意味着在设备待机或空闲状态下能耗很低,适合在对功耗敏感的应用场景中使用。
  • 温度范围:该器件的工作温度范围宽广,适合 -40°C 至 125°C 的极端环境,确保其在各种环境条件下的可靠性。

3. 应用场景

SN74LVC1G14DBVR 的应用非常广泛,涵盖多个领域:

  • 消费电子:例如数字相机、便携式媒体播放器等,对信号处理敏感性能要求较高的消费电子产品。
  • 工业控制:在恶劣的工业环境中,该器件凭借其较宽的温度范围和低功耗特性,可用作各种自动化设备的信号处理单元。
  • 通信设备:在网络设备和通信基础设施中,用于信号整形和逻辑电平变换。
  • 汽车电子:随着现代汽车电子系统的日益复杂化,SN74LVC1G14 可以用于车载设备的信号调理和转换。

4. 封装与安装

该器件采用 SOT-23-5 封装,适合于表面贴装技术(SMT),该封装类型在空间受限的设计中具有优势。此外,SOT-23-5 封装的引脚间距合理,能够与自动贴片设备兼容,通过现代的制造工艺能够实现高密度电路设计的需求。

5. 总结

SN74LVC1G14DBVR 是一款集成效率高、性能优异的施密特触发反相器,适合多种应用场景。德州仪器凭借其卓越的技术背景,为该器件提供了高可靠性和长期稳定运行的保证。在电子设计不断向集成化、智能化发展的大趋势下,该器件无疑将在未来的多个领域中继续发挥重要作用。选择 SN74LVC1G14DBVR,不仅是对产品性能的保障,更是对产品可靠性的承诺。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.