Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TI SN74LVC1G08DBVR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TI(Texas Instruments) SN74LVC1G08DBVR
- Type
- TI
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TI(Texas Instruments)
- Electronic Component
- SN74LVC1G08DBVR
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- Logic Gate
- Electronic Component
- 74LVC
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- Driver
- Electronic Component
- BM0093065427
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 1.65V~5.5V
- Logic Type
- and Gate
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SN74LVC1G08DBVR 产品概述
产品简介
SN74LVC1G08DBVR 是德州仪器（Texas Instruments）推出的一款高性能单通道与门（AND gate）集成电路，采用 SOT-23-5 封装，极其适合各种数字逻辑电路的应用。这一器件不仅支持宽范围的供电电压、低静态电流和高输出能力，还具备极高的工作温度范围，使其在不同环境下均能稳定运行。
基本参数
安装类型: 表面贴装型（SMD）
供电电压: 1.65V 至 5.5V
静态电流: 最大 10µA
工作温度范围: -40°C 至 125°C
最大传播延迟: 4ns（在5V，50pF时）
输出电流: 高电平和低电平输出能力均为 32mA
输入数: 2（2个输入端）
电路数: 1（单通道）
逻辑类型: 与门
封装: SOT-23-5
应用领域
SN74LVC1G08DBVR 主要用于各种数字电路设计中，例如：
- 消费电子: 用于音频、视频设备和家庭自动化系统。
- 工业控制: 在传感器接口和控制单元中实现基本的逻辑功能。
- 通信设备: 用于数据处理和控制信号管理。
- 汽车电子: 在车载系统中用于执行信号处理和逻辑控制。
由于其广泛的供电电压范围和高温工作性能，这款与门 IC 特别适合用于需要灵活性和高可靠性的应用。
优势特点
宽供电电压: 其供电范围为 1.65V 至 5.5V，使得 SN74LVC1G08DBVR 能够适用于多种电源配置，特别是低电压系统。
极低的静态电流: 最大静态电流仅为 10µA，在待机或低功耗应用中能够大幅度减少能耗，提高系统整体效率。
快速响应时间: 在标准操作条件下，其最大传播延迟仅为 4ns，能够满足高频率应用的需求，支持高速数据处理。
高输出能力: 输出电流高达 32mA 酷使其适用于驱动较大的负载，能够为后续电路提供充足的信号强度。
广泛的工作温度: 工作温度范围从 -40°C 到 125°C，确保在严苛环境下的可靠工作，适用于工业或汽车等高要求应用场景。
封装与尺寸
SN74LVC1G08DBVR 采用 SOT-23-5 表面贴装封装，尺寸小巧，便于在空间有限的设计中集成。其封装设计使得电路在高密度布置时依然能够保持良好热管理和信号完整性。
结语
SN74LVC1G08DBVR 是一款功能强大的与门 IC，凭借其出色的电气性能和灵活的工作条件，适合广泛的应用。无论是在消费电子、工业控制还是汽车电子领域，它都能够提供可靠的逻辑控制功能，为设计人员和工程师带来无与伦比的便利与效能。通过利用 TI 的 SN74LVC1G08DBVR，用户能够在设计中构建出更高效、更智能的系统。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
