Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK C2012X5R1V226MT000E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK C2012X5R1V226MT000E
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- C2012X5R1V226MT000E
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.042g
- Electronic Component
- 1
- Electronic Component
- BM0209566223
- Electronic Component
- X5R
- Voltage
- 35V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：C2012X5R1V226MT000E
一、产品背景
电子元器件在现代电子设备中扮演着至关重要的角色，其中贴片电容（MLCC）作为一种广泛应用的电容器，以其高性能、小体积和良好的温度特性，在智能手机、平板电脑、家用电器以及各种嵌入式系统中得到了广泛应用。本产品C2012X5R1V226MT000E是由知名电子元件制造商TDK公司生产的一款贴片电容，具备卓越的电气性能与稳定性，适用于多种应用场合。
二、产品基本参数
- 产品类型：贴片电容（MLCC）
- 额定电压：35V
- 容量值：22uF
- 电容量公差：±20%
- 温度特性：X5R
- 封装尺寸：0805（单位：英寸，约2.0mm x 1.25mm）
三、技术特性与优势
额定电压与电容量： C2012X5R1V226MT000E的额定电压为35V，适合用于需要较高电压应对的电路设计。同时，22uF的电容量在大多数应用中能提供足够的能量存储，从而满足快速充放电的需求。
温度特性： 产品采用X5R温度特性，其温度范围为-55°C至+85°C，并具备一定的电容量温度变化特性。X5R材料的优点在于在宽温度范围内保持较为稳定的电容量，适合于温度波动较大的设备。
小型封装： 0805的封装尺寸使得该电容器在空间紧凑的电路板设计中具有极好的灵活性。小型封装不仅有利于电路板的布线，还能显著降低整体设备体积，满足现代小型化需求。
高可靠性与长寿命： TDK作为行业领军品牌之一，其产品经过严格的质量控制和多项测试，确保用户获得高可靠性和长寿命的产品性能。此外，MLCC结构稳固，具备较强的耐用性及抗潮湿性，适用于各种环境条件。
四、应用场景
得益于其优越的技术参数与电气性能，C2012X5R1V226MT000E广泛应用于多个领域，包括但不限于：
- 消费电子：如智能手机、平板电脑、智能穿戴设备等，提供电源管理及去耦功能。
- 工业设备：在测量仪器与控制装置中，用于滤波和储能。
- 汽车电子：在汽车电力系统中，进行稳压和去耦，确保系统的稳定性和安全性。
- LED照明：在LED驱动电路中进行功率管理，提高能效与可靠性。
五、典型应用电路示例
在快速充放电电路中，C2012X5R1V226MT000E可以用于直流-直流转换器（DC-DC），充当输出电容，以降低输入的纹波，提高电路的稳定性。此外，在RF设备中，也可作为去耦电容，改善信号稳定性，减少干扰。
六、总结
C2012X5R1V226MT000E贴片电容是TDK公司在MLCC领域里的高品质产品，凭借其高可靠性、小型化设计和卓越的电气性能，成为众多电子产品设计者的首选。无论是在消费电子还是工业应用中，其均可发挥关键作用。若希望实现更高效、更稳定的电路性能，选择C2012X5R1V226MT000E将是一个明智之选。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
