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TDK MLZ1608M4R7WT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLZ1608M4R7WT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLZ1608M4R7WT000
- Electronic Component
- 1
- Package
- 0603
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.033g
- Inductor
- 4.7uH
- Electronic Component
- 1
- Electronic Component
- BM0228594299
- Current
- 350mA
- Resistor(DCR)
- 500mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLZ1608M4R7WT000 产品概述
一、概览
MLZ1608M4R7WT000 为 TDK 系列 0603（MLZ1608）封装的叠层贴片电感，标称电感值 4.7 µH，公差 ±20%。该器件体积小、结构稳定，适用于空间受限且需一定电感量的贴片电路。
二、主要电气参数
- 电感值：4.7 µH ±20%
- 额定电流（Ir）：350 mA（基于温升和热特性承受的连续电流）
- 饱和电流（Isat）：120 mA（直流偏置时电感值显著下降的参考电流，厂商常按电感下降到额定值的一定比例定义，详情请参照原厂规格书）
- 直流电阻（DCR）：约 500 mΩ（对功率损耗和温升影响显著）
- 类型：叠层电感（多层陶瓷结构）
- 封装：0603（体积小，适合自动贴装）
三、性能特点与影响
- 小封装、适合高密度贴装应用；
- 相对较高的 DCR（~500 mΩ）意味着在较大直流电流下会产生明显的 I²R 损耗和温升，须评估热预算；
- Isat（120 mA）明显低于额定电流，表明当电路中存在持续直流偏置时，电感值可能发生较大衰减；应区分“允许通过电流”（热/额定）与“保持电感不饱和的电流”（Isat）两种概念；
- ±20% 容差适用于去耦、滤波和抑制干扰等对精度要求不高的场合。
四、典型应用场景
- 低电流的滤波与去耦（如模拟/数字接口、传感器供电线滤波）；
- EMI 抑制、信号线噪声滤除；
- 便携式设备中对空间和成本敏感但电流要求不高的电路；
不建议用于高电流、需维持精确电感值的功率型 DC-DC 输出电感。
五、选型与使用建议
- 若电路中存在直流偏置接近或超过 120 mA，应优先选择 Isat 更高的器件以避免电感饱和；
- 在考虑热耗与效率时，应基于 DCR 计算 I²R 损耗并确认 PCB 热散能力；
- 评估频率特性（频率依赖的阻抗、共振频率）以保证在目标工作频段有足够的阻抗；
- 参考 TDK 原厂数据手册获取详细的频率响应、温度系数和机械尺寸信息。
六、封装与装配注意事项
- 0603 封装适合回流焊，建议遵循 TDK 的回流温度曲线与焊盘设计；
- 贴装时避免在器件上施加过大机械应力，防止裂纹或内部损伤；
- 存储与湿度控制按常规 SMD 元器件管理，必要时进行烘干处理以免回流时出现焊接缺陷。
如需更详细的频率特性曲线、温度范围、机械尺寸图或可靠性测试数据，请告知，我可以帮您索取或分析 TDK 原厂规格书中的具体曲线与参数。
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