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TDK MLG0603P4N3HT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG0603P4N3HT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603P4N3HT000
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Inductor
- Electronic Component
- ±3%
- Electronic Component
- 0.009g
- Inductor
- 4.3nH
- Electronic Component
- 1
- Factor
- 14@500MHz
- Electronic Component
- BM0227752179
- Current
- 350mA
- Frequency
- 5.8GHz
- Resistor(DCR)
- 240mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG0603P4N3HT000 产品概述
一、概述
MLG0603P4N3HT000 为 TDK 提供的一款贴片电感，标准标称电感值为 4.3 nH，公差 ±3%。产品以超小体积封装适配高密度 PCB 设计，适用于对体积与频率响应有较高要求的射频与高速电路。标注参数显示其在频率至 GHz 级别仍能保持良好特性，适合射频匹配、滤波与抗干扰用途。
二、主要技术参数
- 电感值：4.3 nH ±3%
- 额定电流：350 mA
- 直流电阻 (DCR)：240 mΩ
- 品质因数：Q = 14 @ 500 MHz
- 自谐振频率 (SRF)：5.8 GHz
- 封装：0201（超小型贴片）
- 品牌：TDK
三、性能与特点
该器件电感值较低、SRF 高（5.8 GHz），适合工作在数百 MHz 到数 GHz 范围的应用，Q 值中等（500 MHz 时约 14），在射频匹配网络中能提供较低损耗的感性元件。DCR 相对偏大（240 mΩ），在直流偏置或要求极低串联电阻的应用中需注意损耗与发热；额定电流 350 mA 要求在电源或高电流路径使用时进行电流余量评估。
四、典型应用场景
- 射频前端匹配与阻抗调整（Wi‑Fi、蓝牙、子 GHz 通信 等）
- 高频滤波器、谐振回路和谐振器件微调
- 高频信号的线间去耦与噪声抑制
- 紧凑型移动设备、无线模块和射频模块的 PCB 布局
五、PCB 布局与焊接建议
0201 封装对焊盘尺寸与回流工艺敏感：
- 推荐按厂商焊盘图设计，保证焊点量与焊接可靠性；
- 回流曲线应遵循无铅工艺要求，避免过高峰值温度或过长高温驻留；
- 尽量减少元件两端的机械应力与焊接拉力，布线时避免在元件边缘打孔或深槽；
- 对高频应用，保持元件附近走线短且阻抗可控，减小寄生电容和耦合。
六、可靠性与选型注意事项
选型时应确认工作频段低于 SRF、考虑 DCR 对系统损耗和温升的影响，并根据工作温度和直流偏置评估电感值漂移与电流降额。若对更低 DCR 或更高电流能力有需求，可在 TDK 或其他厂商中寻找相近电感值但不同封装/类型的替代型号以平衡体积、损耗与功率承载能力。
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