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TDK MLG0603P22NJTZ10
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MLG0603P22NJTZ10
- Type
- TDK
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603P22NJTZ10
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.009g
- Inductor
- 22nH
- Electronic Component
- 1
- Factor
- 14@500MHz
- Electronic Component
- BM0258781218
- Current
- 150mA
- Frequency
- 2.9GHz
- Resistor(DCR)
- 1.31Ω
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG0603P22NJTZ10 产品概述
一、产品要点
MLG0603P22NJTZ10 为 TDK 小型贴片电感，标称电感值 22 nH，公差 ±5%，额定直流电流 150 mA。直流电阻（DCR）为 1.31 Ω，品质因数 Q = 14（测量频率 500 MHz），自谐振频率（SRF）约 2.9 GHz。封装为 0603 系列（请按采购单与数据手册确认具体外形与包装）。本器件适用于对尺寸和射频性能有要求的小功率 RF/滤波电路。
二、电气性能解读
- 22 nH 在 VHF—UHF 频段常用于谐振、阻抗匹配与滤波。
- Q=14@500MHz 表明在 500 MHz 附近损耗适中，适合信号频率在数百 MHz 范围内的射频应用。
- SRF=2.9 GHz 以上时器件呈现电容性行为，超过该频率不宜再当作纯电感使用。
- DCR=1.31 Ω 相对较高，直流路径上会产生显著压降与热耗（在 150 mA 时压降约 0.196 V，功耗约 29.5 mW），因此不适合作为大电流电感或电源滤波主元件。
三、典型应用场景
- 射频前端的匹配网络、谐振回路与滤波器（VHF/UHF/部分 GHz 频段）。
- 高频信号的阻抗隔离、短距离耦合与去耦网络。
- EMI 抑制中对高频成分进行滤除或定点阻抗处理。
- 注意：不推荐用于供电路径的大电流滤波或能量存储场景。
四、PCB 布局与焊接建议
- 采用短且宽的走线连接，尽量减小引线长度以降低寄生电感和损耗。
- 与邻近元件保持合理间距，避免在敏感射频节点产生不期望的耦合。
- 建议按 TDK 建议的回流焊温度曲线进行焊接，防止过热导致性能退化。
- 小封装对贴装精度要求高，推荐使用自动贴装并进行锡膏量与焊盘设计的优化。
五、选型与可靠性注意事项
- 在选型前请核对实际工作频率与电流：若工作频率接近 SRF，需重新评估电感实际值与寄生特性。
- 当电路要求较小的直流压降或更高电流能力时，应考虑 DCR 更低、额定电流更高的器件。
- 建议参考 TDK 官方数据手册以获取完整机械尺寸、温度系数、老化与焊接规范，并做样机验证（LCR 测试、S 参数测量）以确认在目标频段的表现。
如需我可根据您的具体电路频率与板级布局，给出更详细的阻抗匹配建议与 PCB 布局优化方案。
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