Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK CGA2B1X7R1A224KT0Y0E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- TDK CGA2B1X7R1A224KT0Y0E
- Type
- TDK
- Minimum package
- 10000
Technical parameters
- Electronic Component
- TDK
- Electronic Component
- CGA2B1X7R1A224KT0Y0E
- Electronic Component
- 1
- Electronic Component
- 220nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0258757480
- Electronic Component
- X7R
- Voltage
- 10V
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA2B1X7R1A224KT0Y0E 产品概述
一、产品简介
TDK 型号 CGA2B1X7R1A224KT0Y0E 为贴片多层陶瓷电容（MLCC），规格为 0402 封装，容量 220nF（224），容差 ±10%（K），额定电压 10V，介质类型 X7R。该系列针对通用电子产品的去耦、旁路与滤波应用，在尺寸非常小的 0402 封装中实现相对较高的电容值，适合空间受限的高密度 PCB 设计。
二、主要参数与电气特性
- 容量：220nF（0.22µF）±10%
- 额定电压：10V DC
- 介电材质：X7R（工作温度范围典型 -55°C 至 +125°C，温度漂移在该范围内大致 ±15%）
- 封装：0402（公制约 1.0×0.5 mm）
- 频率特性：0402 小封装具有较低 ESL、自谐频率较高，适合高频去耦；但 X7R 为介质型电容，随频率/偏压/温度电容值会变化，应以厂商曲线为准。
- ESR/ESL：极低，适用于快速瞬态响应，但精确数值请参考规格书。
三、应用场景
- 电源去耦与旁路：与更大容量或低 ESR 器件并联，用于抑制中高频噪声。
- 滤波电路：RC/LC 滤波网络中的耦合与旁路元件。
- 空间受限的移动设备、无线终端、汽车电子（需确认AEC认证）、工业控制等领域。
四、设计注意事项
- DC bias 效应：X7R 在加偏压时电容值会下降，特别是在小封装高容量时更明显。设计时应考虑偏压下的有效容量，必要时选更大封装或并联多个电容。
- 温度稳定性：X7R 非精密型材料，温漂、长期稳定性不及 C0G，勿用于高精度计时/谐振电路。
- 布局建议：靠近电源引脚放置以降低寄生感抗；短、宽的走线可以减少 ESL。
- 并联使用：为兼顾低频与高频滤波，可与 1µF/0.1µF 等不同封装/介质的电容并联。
五、焊接与可靠性
- 推荐遵循 TDK 的回流焊曲线（参考 J-STD-020），避免超过制造商推荐的峰值温度和滞留时间以防应力裂纹。
- 0402 封装对机械应力敏感，PCB 设计与贴装工艺需控制焊膏量与回流速度，以降低热机械失效风险。
- 产品符合常规环保与可靠性测试标准，具体认证与环境/寿命试验结果请参阅 TDK 官方规格书。
六、型号与选型提示
型号编码可对应如下要素：CGA 系列、0402 尺寸、X7R 介质、224 表示 220nF、K 表示 ±10%、后缀为电压与包装信息。选型时请核对工作电压、偏压下的有效电容、温度范围及包装形式（卷盘）以满足生产与可靠性需求。更多详尽电气特性与测试曲线请参阅 TDK 官方数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
