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TDK C1608X5R1E335KT000E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- TDK C1608X5R1E335KT000E
- Type
- TDK
- Minimum package
- 4000
Technical parameters
- Electronic Component
- TDK
- Electronic Component
- C1608X5R1E335KT000E
- Electronic Component
- 1
- Electronic Component
- 3.3uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0227328005
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1608X5R1E335KT000E 产品概述
一、主要参数
TDK 型号：C1608X5R1E335KT000E；封装：0603（1608公制，约1.6 × 0.8 mm）；介质：X5R；额定电压：25 V DC；名义电容：3.3 μF；公差：±10%（K）。该器件为多层陶瓷贴片电容（MLCC），适合对体积和旁路性能有较高要求的场合。
二、产品特点
- 体积小、容值高：在0603封装中实现3.3 μF，具有较高的体积电容密度，便于高密度布局。
- 稳定性与温度特性：X5R 介质在 −55°C 至 +85°C 范围内工作，温度引起的电容漂移通常在规范范围内（X5R 属于中等稳定性陶瓷）。
- 低等效串联电阻（ESR）与低寄生电感（ESL）：适合高频去耦和瞬态电流滤波。
- 商业级质量与大批量可供：TDK 品牌，适合消费类与工业电子中通用应用。
三、典型应用
- 电源去耦与旁路（CPU、PMIC、DC-DC 输出侧）
- 输入滤波与能量缓冲（便携设备、通信模块）
- 模拟电路的耦合/去耦（对噪声抑制有中等要求）
注：若用于汽车或高可靠性场合，请确认器件是否具备 AEC 等级或额外认证。
四、使用与布局建议
- 靠近负载或芯片电源引脚放置，走线尽量短且宽，减少回流环路面积。
- 对于多电平电源，建议并联不同容值和介质的电容以兼顾低频与高频性能。
- 焊接采用推荐回流曲线，避免过温或过长时间的再流，减少热应力对电容性能与寿命的影响。
- 避免 PCB 弯曲或强力刮擦，MLCC 对机械应力敏感，易在应力集中处出现裂纹。
五、电气性能注意事项
- DC 偏压效应：高介电常数陶瓷在施加直流偏压时电容会下降，建议查阅 TDK 数据手册中的偏压曲线，实际工作电容通常低于标称值。
- 温度依赖：X5R 在温度范围内电容变化应符合规范，但不如 C0G/NP0 稳定，关键电路请谨慎评估。
- 漏电流与耐压：请参考原厂数据表获取绝缘电阻、耐压与额定电流信息以满足系统设计要求。
六、包装与可靠性
标准供应形式为卷带（Tape & Reel）以适配贴片机，具体卷盘尺寸与包装量可向供应商确认。TDK 产品通常符合 RoHS 要求，生产和质量控制成熟，适合大规模制造。
七、选型与资料建议
完整型号 C1608X5R1E335KT000E 已包含关键规格，选型时请对比实际电压、环境温度、DC 偏压与寿命要求。强烈建议下载并参考 TDK 官方数据手册和温度/偏压特性曲线、回流焊接说明以及可靠性试验数据，以保证在目标应用中的性能与可靠性。若需更高温度稳定性或汽车级器件，可咨询替代型号或厂商支持。
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