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TDK CGA2B1X7R1V224KT000F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK CGA2B1X7R1V224KT000F
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- CGA2B1X7R1V224KT000F
- Electronic Component
- 1
- Electronic Component
- 220nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0257285482
- Electronic Component
- X7R
- Voltage
- 35V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK CGA2B1X7R1V224KT000F 产品概述
一、产品简介
TDK CGA2B1X7R1V224KT000F 是一款贴片多层陶瓷电容（MLCC），额定电容量为 220 nF，公差 ±10%，额定电压 35 V，温度特性为 X7R，封装尺寸为 0402（约 1.0 mm × 0.5 mm）。该型号适用于对体积要求高且需中等温度稳定性的去耦、滤波与耦合应用。
二、主要参数
- 电容值：220 nF（0.22 µF）
- 精度：±10%
- 额定直流电压：35 V
- 温度特性：X7R（-55°C 至 +125°C）
- 封装：0402（公制 1005）
- 制造商：TDK
三、特性与优势
- 小封装、高密度：0402 尺寸便于在空间受限的 PCB 上实现高密度布局。
- 稳定的温度性能：X7R 材料在宽温区间内保持较好的电容稳定性，适合大多数商用与工业环境。
- 良好的工艺兼容性：支持标准回流焊工艺，适合表面贴装生产线。
- 品牌与质量保障：TDK 作为资深元件厂商，提供一致性良好的产品批次与可靠性文档。
四、典型应用场景
- 电源去耦与旁路（DC-DC 模块、MCU 电源）
- 高频滤波与耦合电路（模拟前端、射频系统的低频段滤波）
- 移动与便携设备、传感器模块以及通信设备中对体积与性能有平衡需求的场合
五、使用与封装注意事项
- DC 偏压效应：X7R 在加电压时会出现一定的电容下降，设计时需考虑直流偏置对有效电容的影响。
- 机械应力敏感：0402 芯片因尺寸小而易受焊接或 PCB 弯曲引起的应力损伤，设计焊盘与 PCB 压力缓释结构可提高可靠性。
- 焊接建议：遵循厂家回流焊温度曲线与焊膏使用说明，避免过高峰值温度与过长热暴露。
- 贮存环境：避免潮湿、高温及剧烈震动；开卷后建议尽快使用或按干燥柜/干燥箱管理。
六、选型建议与替代考虑
在需更高温度稳定性或更小电容变化时，可考虑 C0G/NP0 系列；若追求更大容量且对稳定性要求不高，可选用更高介电常数的封装（但需留意 DC 偏压与温度漂移）。选型时同时评估工作电压、环境温度、封装限制与成本，确保电容在实际工况下仍满足功能需求。
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