Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK CGA2B2X7R1H221KT0Y0F
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
14
specifications
Core information
- Product name
- TDK CGA2B2X7R1H221KT0Y0F
- Type
- TDK
- Minimum package
- 10000
Technical parameters
- Electronic Component
- TDK
- Electronic Component
- CGA2B2X7R1H221KT0Y0F
- Electronic Component
- 1
- Electronic Component
- 220pF
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM0257238903
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA2B2X7R1H221KT0Y0F 产品概述
一、产品简介
TDK 型号 CGA2B2X7R1H221KT0Y0F 为多层陶瓷电容（MLCC），属 SMD/SMT 0402 封装小尺寸器件。标称容量 220pF，额定直流电压 50V，介质温度系数 X7R，厚度约 0.5mm，容差 K（±10%）。该系列以体积小、容值稳定、工艺成熟著称，适合空间受限的印制板设计。
二、主要参数与含义
- 容值：220pF（标称）
- 额定电压：50V DC
- 温度系数：X7R（-55°C 至 +125°C，最大温度漂移约 ±15%）
- 尺寸/封装：0402（常见尺寸 1.0 × 0.5 mm，厚度约 0.5 mm）
- 容差：K（±10%）
这些参数决定了器件在温度、偏置和机械应力下的性能范围。
三、电气特性与实际注意事项
X7R 属于 II 类介质，具有较高的体积效率但存在典型特性：在直流偏压下电容值会明显下降（随偏压增加而减少），且随时间存在老化效应（需参考厂方老化/偏置曲线）。损耗角正切（DF）和等效串联电阻（ESR）通常较低，适合高频旁路与滤波，但不适合要求极高稳定性的谐振或时基元件（此类应选 NPO/COG）。
四、封装、焊接与可靠性建议
0402 体积小，安放需高精度贴装；焊膏量与焊盘设计直接影响焊接可靠性。遵循厂方回流曲线进行焊接，避免过度机械应力（如板弯曲或螺丝紧固导致断裂）。焊盘应尽量短连线，贴片时靠近电源/地引脚以减小走线电感。储存与湿度处理按标准烘烤/防潮规定执行。
五、典型应用场景
适用于消费电子、通讯设备、工业控制等领域的高频旁路、去耦、噪声抑制、RC 滤波网络或阻抗匹配前端的微量电容需求。因 50V 额定电压，亦可用于中低电压电源旁路或耦合场合。
六、选型与验证建议
选型时注意检视电压-电容曲线与老化数据，若电路对容值稳定性要求高，应留有裕量或改用低漂移介质。工程样板阶段建议进行温度循环、偏压下的 LCR 测试（典型频率 1 MHz）以及焊接可靠性验证，以确保在目标应用环境下满足性能与寿命要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
