Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK MHQ1005P3N0BT000
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MHQ1005P3N0BT000
- Type
- 0402
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MHQ1005P3N0BT000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 3nH
- Electronic Component
- 1
- Factor
- 23@250MHz
- Electronic Component
- BM0058410739
- Current
- 900mA
- Frequency
- 6GHz
- Resistor(DCR)
- 60mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MHQ1005P3N0BT000 产品概述
一、概述
MHQ1005P3N0BT000 是 TDK 推出的叠层陶瓷贴片电感，封装为 0402（公制 1.0×0.5 mm），额定电感 3 nH。该器件为高频应用优化，具有较低直流电阻与良好的品质因数，适合空间受限的射频与高速电路中作为匹配、阻抗控制与 EMI 抑制元件使用。
二、主要参数
- 电感值：3 nH
- 直流电阻（DCR）：典型 60 mΩ（依据测量与批次差异，实际可达 ~80 mΩ）
- 品质因数：Q = 23 @ 250 MHz
- 自谐振频率（SRF）：约 6 GHz
- 额定电流：900 mA（最大连续通过电流，超出可能导致电感值变化或损坏）
- 类型：叠层陶瓷电感（SMD，0402）
- 品牌：TDK
三、性能特点
- 高频性能良好：Q 值在 VHF/UHF 频段表现优异，适合射频匹配与滤波网络。
- 宽带使用上限高：SRF ≈ 6 GHz，工作频率可覆盖从几十 MHz 至数 GHz 的设计需求，超过 SRF 后电感呈容性行为需注意。
- 低损耗与低 DCR：典型 DCR 低，有利于减少串联损耗与热升高，适合对功率和效率有要求的线路。
- 小尺寸大电流承载：0402 小封装兼顾 900 mA 额定电流，适合空间受限但需一定电流能力的设计。
四、典型应用
- 射频匹配网络与滤波器（VHF/UHF、射频前端）
- 高频去耦、偏置网络（bias-tee）与DC注入元件
- EMI 抑制与信号完整性改善
- 无线模块、射频收发器、时钟分配与高速接口线路
五、封装与焊接建议
- 建议按 TDK 数据手册推荐的 PCB 焊盘尺寸布局，保证焊点可靠性与热循环稳定性。
- 采用无铅回流焊工艺时请遵循器件耐温极限与 JEDEC 回流曲线（峰值温度与保温时间以厂家规范为准）。
- 安装时避免在焊接后对板材进行过度弯曲，以免引起陶瓷器件裂纹。
六、设计注意事项与对比参考
- 在靠近 SRF 的频段设计时，应考虑电感的寄生电容与频率响应，必要时搭配仿真与实际测试调优。
- 对比线绕电感：叠层电感体积更小、成本可控且频率响应更平滑，但在大电流与高饱和要求下可能不如线绕型。
- 考虑温漂与介质特性：具体温度系数与电感稳定性请参照 TDK 完整规格书并在系统级测试中验证。
七、可靠性与选型建议
- 若工作电流长期接近 900 mA，应做热升测试并留有裕量。
- 对有严格频率稳定性或高功率需求的项目，建议索取样片并在目标板上进行 S-参数与温度循环测试。
- 采购时确认批次参数（DCR、Q、SRF）以保证与系统设计一致。
如需更详细的封装尺寸、焊盘推荐及完整电气、环境规范，请参阅 TDK 官方规格书或联系供应商获取样品与测试数据。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
