Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK MHQ1005P2N2BT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MHQ1005P2N2BT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MHQ1005P2N2BT000
- Electronic Component
- 1
- Package
- SMD
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 2.2nH
- Electronic Component
- 1
- Factor
- 23@250MHz
- Electronic Component
- BM0262575478
- Current
- 1A
- Frequency
- 12.1GHz
- Resistor(DCR)
- 40mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MHQ1005P2N2BT000 产品概述
一、产品简介
MHQ1005P2N2BT000 是 TDK 旗下的叠层贴片电感，标称电感值为 2.2 nH，封装为 SMD 机贴型，外形尺寸约 0.6 × 1.0 mm（1005/0402 尺寸）。该器件针对高频应用优化，具有较高自谐振频率与适中的品质因数，适合移动终端与射频前端等紧凑型 PCB 布局场景。
二、主要性能参数
- 电感值：2.2 nH
- 额定电流：1 A
- 直流电阻（DCR）：40 mΩ
- 品质因数（Q）：23 @ 250 MHz
- 自谐振频率（SRF）：12.1 GHz
- 类型：叠层电感（Multilayer）
- 封装/尺寸：SMD，0.6 × 1.0 mm
- 品牌：TDK
三、主要特性与优势
- 高频性能优异：SRF 高达 12.1 GHz，适合 GHz 级别的射频匹配与滤波应用。
- 低损耗设计：在 250 MHz 时 Q≈23，意味着在通信频段具有良好选择性与低能量耗散。
- 小型化封装：1005 规格有利于高密度布板，便于移动设备、Wi‑Fi/蓝牙模块等小型化产品集成。
- 合理的电流承载能力：1 A 额定电流满足多数射频及去耦场景的电流需求，DCR 40 mΩ 在额定电流下功耗约 0.04 W（I^2·R）。
四、典型应用场景
- 射频阻抗匹配网络与微带线滤波器
- 高速接口与终端的 EMI 抑制与共模/差模滤波（配合电容使用）
- 无线通信模块（Wi‑Fi、蓝牙、手机射频前端）
- 高频去耦与谐振电路中的小电感值要求场合
五、PCB 设计与使用建议
- 布局：尽量缩短电感两端的串联走线，减小寄生电感与环路面积。
- 焊盘与回流：遵循制造商推荐的焊盘尺寸并采用标准无铅回流焊工艺；避免在回流过程中超过器件允许的热应力。
- 热与电流：在持续接近 1 A 或高频大电流情形中注意散热和功耗，必要时进行热仿真验证。
- 测试：高频性能受 PCB 走线与附近元件影响较大，最终设计需在板上做实际网络分析仪测量并调整匹配元件值。
六、包装与选购建议
- 本型号为 SMD 机带卷装，适合自动贴装生产。
- 选型时注意与系统频段、允许损耗及电流裕度对应；若工作频段接近 SRF，应考虑留有裕量或选用更高 SRF 的型号。
- 如需更高电流或更低 DCR，可向供应商咨询相近系列的替代件或定制化选型。
若需器件的封装尺寸图、回流焊曲线或在特定频段的 S 参数曲线，可进一步提供具体资料以便确认最终适配方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
