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TDK C1005X7S2A103KT000F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK C1005X7S2A103KT000F
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- C1005X7S2A103KT000F
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0257285785
- Electronic Component
- X7S
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1005X7S2A103KT000F 产品概述
一、主要参数
C1005X7S2A103KT000F 为 TDK 生产的贴片多层陶瓷电容（MLCC），主要参数如下：
- 容值：10 nF（103）
- 精度：±10%（K）
- 额定电压：100 V DC
- 温度特性：X7S（-55°C 至 +125°C，介电特性为 II 类）
- 封装：0402（1005 公制，约 1.0 mm × 0.5 mm）
- 封装形式：贴片（适用于自动贴装回流焊）
二、产品特性
该型号在小尺寸下提供相对较高的额定电压和中等容值，具有以下优点：
- 体积小、密度高，适合高密度 PCB 布局
- ESR/ESL 低，适合高频滤波与去耦应用
- X7S 介质在宽温度范围内保持可用电容量（但属 II 类介质，随温度与偏压有一定变化）
- 稳定的电气性能和长期可靠性，适配工业与消费类电子设计
三、典型应用
- 电源去耦与旁路（尤其在空间受限且需较高工作电压的电路）
- 输入滤波与旁路电容
- 高频耦合与阻尼网络
- 射频前端的旁路与滤波（需注意介质的非线性）
- 小体积高压应用，如便携测量仪器、传感接口等
四、封装与尺寸建议
0402（1005）封装适合高密度贴装。建议根据制造商参考布局推荐设计焊盘，以优化焊接可靠性和回流焊润湿。注意 PCB 焊盘尺寸与焊膏印刷厚度的配合，避免虚焊或桥连。
五、装配与使用建议
- 遵循 TDK 推荐的回流焊曲线，避免超温或过快升降温引起裂纹。
- 贴装时避免机械冲击与弯曲应力，0402 尺寸对机械应力敏感。
- 设计时考虑 DC 偏压和温度对容值的影响，必要时留出裕量或作实测验证。
- 存放时保持原厂防潮包装，长期库存遵循制造商建议的储存条件。
六、可靠性与注意事项
X7S 为 II 类介质，具有较高的容值密度但存在温度漂移和偏压依赖，故不建议用于高精度定时或参考电路。对于关键应用，请参考 TDK 的失效率与应力测试数据，并在设计中考虑合适的安全裕度。
七、选型参考
若需要更高稳定性和低温漂，可考虑 C0G/NP0 系列；若对容值密度要求更高但电压低，可选 X5R/X7R 系列。C1005X7S2A103KT000F 在小尺寸与较高工作电压之间提供了良好平衡，适合对体积和电压有双重要求的设计。
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