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TDK CGA2B2NP01H100DT0Y0F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- TDK CGA2B2NP01H100DT0Y0F
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- CGA2B2NP01H100DT0Y0F
- Electronic Component
- 1
- Electronic Component
- 10pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM0257238897
- Electronic Component
- NP0
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK CGA2B2NP01H100DT0Y0F 产品概述
一、产品概要
TDK 型号 CGA2B2NP01H100DT0Y0F 为贴片多层陶瓷电容（MLCC），额定电压 50V，容值 10pF，温度特性为 NP0（等同 C0G 类别），封装为 0402（约 1.0 mm × 0.5 mm）。该器件面向需要高稳定性、低损耗与小体积的精密与高频电路应用。
二、主要特性
- 温度稳定性优异：NP0 / C0G 特性意味着容值随温度变化极小，典型温度系数接近 0 ppm/°C（通常在 ±30 ppm/°C 范围内），适合对频率、相位、时间常数等要求严格的电路。
- 低介质损耗：适合射频、谐振与高 Q 值场合，信号衰减小，噪声低。
- 小型化封装：0402 外形利于高密度 PCB 布局与移动终端产品设计。
- 耐压 50V：适用于中低电压信号路径与耦合/旁路用途。
三、典型应用场景
- 高频振荡器、滤波与匹配网络（RF 前端）
- 精密定时电路、相移网络与采样电路
- ADC/DAC 前端与参考回路的旁路与去耦
- 传感器接口与低噪放大器的耦合元件
四、设计与使用建议
- 在对稳定性要求高的回路（如振荡器）中尽量靠近器件引脚布置，减小寄生电感、电阻。
- 对于高可靠性产品，建议在布局时避免将 0402 元件置于 PCB 边缘或易受机械应力处，减少焊接与回流后开裂风险。
- 对湿敏等级按制造商建议处理，必要时进行烘烤处理后再回流焊接。
- 若用于高频场合，注意走线阻抗与地平面完整性，尽量缩短走线长度。
五、可靠性与封装工艺
该系列采用先进陶瓷堆叠与金属化端接工艺，适配常规无铅回流焊曲线。0402 小尺寸要求在贴装与回流过程中严格控制温度与焊膏量，保证焊点完整与机械强度。针对量产请参考 TDK 提供的封装与回流曲线资料以优化工艺参数。
如需更详细的电气参数（如损耗角正切、绝缘电阻、寿命测试数据或封装尺寸公差），建议参考 TDK 官方数据手册或向代理商索取样片与测试报告。
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