Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK NTCG103JF103FT1A是一款专为小型化、高精度温度检测设计的NTC热敏电阻,属于TDK ECO系列产品。型号中:
该产品的电气与物理参数经过严格标定,核心指标如下:
该产品在性能与应用适配性上具备显著优势:
阻值与B值双精度控制(均±1%),相比普通NTC热敏电阻,温度检测误差更小。例如在电池过温保护场景中,可精准识别0.5℃以内的温度变化,避免误触发或延迟保护。
-40℃~+125℃的工作范围覆盖了工业控制、消费电子、IoT终端等多领域的典型环境:
0402封装是当前小型电子设备的主流选择,可直接集成在:
100mW额定功率满足常规电路需求,耗散系数1mW/℃的设计可通过限流电路进一步降低自热影响(如串联10kΩ电阻时,电流≤1mA,功耗≤10μW,自热可忽略)。
结合参数特性,该产品广泛应用于以下场景:
为确保性能稳定,需注意以下要点:
根据实际工作温度选择对应的B值:
工作时需确保电流≤310mA(25℃)、功耗≤100mW,可通过串联限流电阻或恒流源驱动实现(如1mA恒流源,功耗仅10μW)。
0402封装需采用回流焊工艺,避免手工焊接导致的虚焊或热损伤(焊接温度需符合TDK推荐值:峰值245℃±5℃,时间≤10s)。
对于医疗级、工业级高精度场景(如±0.1℃检测),建议在实际应用温度区间对器件进行校准,进一步提升准确性。
TDK NTCG103JF103FT1A凭借高精度、宽温域、小体积等核心优势,成为多领域温度检测的可靠选择。既满足消费电子的小型化需求,也适配工业控制的稳定性要求,是电子设备热管理与温度传感的高性价比解决方案。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products